Ultra-low Power, Low Latency Audio for Wireless Gaming Headphone

NXH3670

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The NxH3670 constitutes a highly integrated, single-chip ultra-low-power 2.4 GHz wireless transceiver with embedded MCU (Integrated Arm® Cortex®-M0 processor), targeted at wireless audio streaming for gaming headphones, delivering low latency audio and ultra-low power consumption.

The NxH3670 runs a proprietary wireless audio streaming protocol which has been optimized for wireless gaming headset applications, providing high-quality forward audio streaming at low latency (<20ms) combined with a simultaneous voice microphone backchannel. Additionally, a wireless bidirectional data channel is available.

While primarily designed for headsets, this solution can also enable wireless audio streaming for household and office devices like soundbars, wireless speakers, wireless Subwoofers and more.

Overall, the NxH3670 delivers a small form factor with long battery life while reducing overall weight and size.

Product Details

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Block Diagram

NxH3x70

NxH3x70 Block Diagram

Features

Key Features

  • Bluetooth® Low Energy 4.2 certified with proprietary audio streaming extension
  • Programmable TX output power of −10 dBm to +4 dBm in 2 dB steps
  • Sensitivity −90 dBm in Bluetooth LE 2 Mbps modulation mode and −94 dBm in Bluetooth LE 1 Mbps modulation mode
  • Industry-lowest current consumption of RX current < 4 mA at 1.2V and TX current < 7 mA (0 dBm output power) at 1.2V
  • Integrated audio interfaces and audio processing
  • WLCSP package < 7.25 mm2 with 34 bumps
  • Low number of external passive components
  • Pb-free and compliant with RoHS Directive 2011/65/EU (RoHS 2)
  • Operating temperature -20 °C to +85 °C

Wireless Audio Modules

Description Features Applications
The WB9770-00 module from JORJIN is a wireless audio module targeting at wireless audio streaming for hearables, wireless headsets and headphones applications. This module is based on NXP NXH3670 and KL27.
  • NXP NXH3670UK and MKL27Z256VMP4, crystals and chip antenna on a single module.
  • LGA90 pins package.
    • Dimension 19.5mm(L)x 12mm(W)
    • Height of the module without antenna is 2.2 mm, with antenna is 2.6 mm.
  • Powerful ARM® Cortex®-M0+ Microcontroller up to 48MHz
    • 256 KB program flash memory, 32 KB SRAM in host controller.
    • USB x 1, I2C x 2, SPI x 1, UART x 2, I2S x 1
    • More than 40 GPIOs
  • 2.4-GHz Wireless Audio streaming solution with Integrated Antenna.
    • Supporting BLE GFSK modulation 1 Mbps and 2 Mbps
    • Audio interfaces and audio processing accelerators
  • RoHS Compliance
  • Operating temperature -20 °C to +85 °C
 Wireless gaming / communication headsets WB9770-00 WIRELESS AUDIO MODULE

Documentation

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Design Resources

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Hardware

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Software

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  • IDE and Build Tools

    NxH3670 SDK Gaming Package

    ZIPRev 9.2Jun 8, 2022 01:00:00627.0 MBNXH3670-SDK-GAMING
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Note: For better experience, software downloads are recommended on desktop.

Training

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