Ultra-Low Power Bluetooth Low Energy Audio Solution with Integrated Flash

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Block Diagram

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NXH3675 Headset Application

NXH3675 Block Diagram - Headset

NXH3675 Features

NXH3675 Features


Application Processors

  • Dual core Cortex-M0+

Flash Memory

  • Embedded Flash

Audio Processors

  • Dual CoolFlux DSP


  • Bluetooth 5.3 LE Audio certified and enables Auracast

Power Management

  • Integrated PMU
  • Li-ion battery


  • LC3 and LC3plus
  • Hi-Res Audio (LC3plus, 48/96 kHz)
  • Equalizer and filtering
  • Voice processing


  • Dual digital microphones
  • Smart boom - beam forming


  • Radio PHY conforms to Bluetooth Low Energy 5.3 Bluetooth specification
  • Pb-free and compliant with RoHS directive 2011/65/EU (RoHS 2)
  • WLCSP package 9.1 mm2 with 48 bumps
  • Low number of external passive components
  • Operating temperature −20 °C to 85 °C

Part numbers include: NXH3675UK.

Comparison Table

Characteristics NXH3670 NXH3675
Processor External Microcontroller Integrated Quad-Core processor
Protocol BLE 4.2 certified
Proprietary audio streaming protocol
BLE 5.3 LE audio certified and enabled with Auracast including scan and delegator for audio sharing, supporting HA and TMAP audio profiles
Connections Point-to-point Multi-stream up to 7 simultaneously
Latency (Down Link) < 20ms (SBC) ~20ms (LC3plus)
NVM External Integrated
Power Consumption (gaming) 8.4mW 8.8mW
Audio Codec SBC / G.722 LC3 and LC3plus
Audio features EQ and filtering EQ and filtering
Hi-Res Audio (LC3plus /96khz)
Voice processing


Quick reference to our documentation types.

1 documents

Design Resources


2 hardware offerings



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