SOT1404-3: WLCSP


Overview

wafer level chip-scale package; 36 bumps; 2.07 x 2.07x 0.42 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom WLCSP 2.07 x 2.07 x 0.42 36
Manufacture Code Reference Codes Issue Date
SOT1404 2016-04-26