SOT1404-3: WLCSP36

Overview

wafer level chip-scale package; 36 bumps; 2.07 mm x 2.07 mm x 0.42 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1404-3	WLCSP36	surface mount	bottom	WLCSP	2.07 x 2.07 x 0.42	36

Manufacture Code	Reference Codes	Issue Date
SOT1404-3		2016-04-26