SOT1444-3: WLCSP


Overview

wafer level chip-scale package; 49 bumps; 2.98 x 3.43 x 0.56 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 2.98 x 3.43 x 0.56 49 plastic
Manufacture Code Reference Codes Issue Date
SOT1444 2015-07-21
Part Description Quick access