SOT1444-8: WLCSP49

Overview

wafer level chip-scale package; 49 bumps; 3.13 x 3.63 x 0.5 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1444-8	WLCSP49	surface mount	bottom	WLCSP	3.13 x 3.63 x 0.5	49	other

Manufacture Code	Reference Codes	Issue Date
SOT1444		2016-08-09