SOT1445-1: WLCSP

Overview

wafer level chip-scale package; 6 bumps; 0.69 x 0.44 x 0.29 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1445-1	WLCSP	surface mount	bottom	UC	0.69 x 0.44 x 0.29	6	plastic

Manufacture Code	Reference Codes	Issue Date
SOT1445		2016-07-11