SOT1450-2: WLCSP100


Overview

WLCSP100, wafer level chip-scale package; 100 bumps; 5.07 mm x 5.07 mm x 0.53 mm body
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP100 surface mount bottom WLCSP 5.07 x 5.07 x 0.53 100
Manufacture Code Reference Codes Issue Date
SOT1450-2 2018-03-06