SOT1450-2: WLCSP100

Overview

WLCSP100, wafer level chip-scale package; 100 bumps; 5.07 mm x 5.07 mm x 0.53 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1450-2	WLCSP100	surface mount	bottom	WLCSP	5.07 x 5.07 x 0.53	100

Manufacture Code	Reference Codes	Issue Date
SOT1450-2		2018-03-06