SOT1455-1: WLCSP8

Overview

WLCSP8, wafer level chip-scale package; 8 bumps, 0.28 mm pitch, 1.16 mm x 0.86 mm x 0.48 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1455-1	WLCSP8	surface mount	bottom	WLCSP	1.16 x 0.86 x 0.48	8

Manufacture Code	Reference Codes	Issue Date
SOT1455-1		2015-08-17