SOT1459-1: WLCSP42

Overview

wafer level chip-scale package; 42 bumps; 2.88 mm x 2.80 mm x 0.54 mm (Backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1459-1	WLCSP42	surface mount	bottom	WLCSP	2.88 x 2.80 x 0.54	42	other

Manufacture Code	Reference Codes	Issue Date
SOT1459		2016-09-01