SOT1459-1: WLCSP42


Overview

wafer level chip-scale package; 42 bumps; 2.88 mm x 2.80 mm x 0.54 mm (Backside coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP42 surface mount bottom WLCSP 2.88 x 2.80 x 0.54 42 other
Manufacture Code Reference Codes Issue Date
SOT1459 2016-09-01
Part Description Quick access