SOT1465-1: WLCSP31

Overview

wafer level chip-scale package, 31 bumps

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1465-1	WLCSP31	surface mount	bottom	WLCSP	2.79 x 3.72 x 0.41	31

Manufacture Code	Reference Codes	Issue Date
SOT1465		2016-04-26