SOT1747-3: HSOP54


Overview

HSOP54, plastic, thermal enhanced small outline package; 54 terminals; 0.65 mm pitch; 7.5 mm x 17.9 mm x 2.33 mm body
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HSOP54 surface mount double HSOP 7.5 x 17.9 x 2.33 54 plastic
Manufacture Code Reference Codes Issue Date
98ASA10506D E-PDSO-G54(JEDEC) 2017-06-11
Part Description Quick access
System Basis Chip, 2 LIN, 2x 5.0 V/400mA LDOs, 3/4 wakeup, SOIC-EP 54
System Basis Chip, 2 LIN, 2x 3.3 V/400mA LDOs, 2/3/4 wakeup, SOIC 32
Low-Side Switch, 16 Channels, SOIC 54
H-Bridge, Brushed DC Motor Driver, 5-28V, 5A, Cur FB, Sleep, SM-5, SOICW-EP 54
5.0V SBC HSCAN DUAL LIN
System Basis Chip, 2 LIN, 2x 3.3 V/400mA LDOs, 2/3/4 wakeup, SOIC 32
5.0V SBC HSCAN DUAL LIN
3.3V SBC HSCAN DUAL LIN
System Basis Chip, 2 LIN, 2x 5.0 V/400mA LDOs, 3/4 wakeup, SOIC-EP 54