SOT1783-1: WLCSP80

Overview

WLCSP80, wafer level chip-size package; 80 terminals; 0.4 mm pitch; 3.56 mm x 4.13 mm x 0.6 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1783-1	WLCSP80	surface mount	bottom	WLCSP	3.56 x 4.13 x 0.6	80

Manufacture Code	Reference Codes	Issue Date
98ASA00710D		2017-06-11