SOT1835-1: WLCSP25

Overview

wafer level chip-scale package, 25 bumps

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1835-1	WLCSP25	surface mount	bottom	WLCSP	3.5 x 2.63 x 0.38	25

Manufacture Code	Reference Codes	Issue Date
SOT1835		2016-04-26