SOT1835-1: WLCSP25


Overview

wafer level chip-scale package, 25 bumps
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP25 surface mount bottom WLCSP 3.5 x 2.63 x 0.38 25
Manufacture Code Reference Codes Issue Date
SOT1835 2016-04-26