SOT1890-3: WLCSP56

Overview

WLCSP56, wafer level chip-scale package; 56 bumps; 0.35 mm pitch, 2.95 mm x 2.6 mm x 0.415 mm body (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1890-3	WLCSP56	surface mount	bottom	WLCSP	2.95 x 2.6 x 0.415	56

Manufacture Code	Reference Codes	Issue Date
98ASA01353D		2019-01-23