SOT1914-1: WLCSP56


Overview

WLCSP56, wafer level chip-scale package; 56 bumps, 0.4 mm pitch, 4.39 mm x 3.59 mm x 0.5 mm body
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP56 surface mount bottom WLCSP 4.39 x 3.59 x 0.50 56
Manufacture Code Reference Codes Issue Date
98ASA01184D 2018-02-08