SOT1942-1: WLCSP40


Overview

WLCSP40, wafer level chip-scale package; 40 bumps; 0.4 mm pitch; 2.25 mm x 3.45 mm x 0.525 mm body (backside coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP40 surface mount bottom WLCSP 2.25 x 3.45 x 0.525 40
Manufacture Code Reference Codes Issue Date
SOT1942-1 2017-09-13
Part Description Quick access