SOT1942-1: WLCSP40

Overview

WLCSP40, wafer level chip-scale package; 40 bumps; 0.4 mm pitch; 2.25 mm x 3.45 mm x 0.525 mm body (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1942-1	WLCSP40	surface mount	bottom	WLCSP	2.25 x 3.45 x 0.525	40

Manufacture Code	Reference Codes	Issue Date
SOT1942-1		2017-09-13

Products

Part	Description	Quick access
NXH2266UK		View parametrics
NXH2265UK		View parametrics