SOT2022-1: HWFLGA38


Overview

HWFLGA38, thermal enhanced very very thin fine-pitch land grid array package, 38 terminals, 0.35 mm pitch, 4 mm x 3 mm x 0.645 mm body
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HWFLGA38 surface mount bottom LGA 4 x 3 x 0.645 38
Manufacture Code Reference Codes Issue Date
98ASA01456D 2019-05-13