SOT2022-1: HWFLGA38

Overview

HWFLGA38, thermal enhanced very very thin fine-pitch land grid array package, 38 terminals, 0.35 mm pitch, 4 mm x 3 mm x 0.65 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT2022-1	HWFLGA38	surface mount	bottom	LGA	4 x 3 x 0.65	38

Manufacture Code	Reference Codes	Issue Date
98ASA01456D		2021-03-22

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