SOT2168-1: HWFLGA60

Overview

HWFLGA60, thermal enhanced very very thin finepitch land grid array package, 0.4 mm pitch, 9.05 mm x 4.05 mm x 0.63 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT2168-1	HWFLGA60	surface mount	bottom	HWFLGA	9.05 x 4.05 x 0.63	60	plastic

Manufacture Code	Reference Codes	Issue Date
98ASA01867D		2022-10-31