SOT2198-1: H-FC-PBGA798

Overview

H-FC-PBGA798, thermal enhanced - flip chip - plastic ball grid array, 798 terminals, 0.65 mm pitch, 19 mm x 19 mm x 1.94 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT2198-1	H-FC-PBGA798	surface mount	bottom	H-FC-PBGA	19 x 19 x 1.94	798	plastic

Manufacture Code	Reference Codes	Issue Date
98ASA01985D		2024-06-07