SOT2277-1: WLCSP123

Overview

WLCSP123, wafer level chip-size package, 123 terminals, 0.4 mm pitch, 4.95 mm x 4.395 mm x 0.525 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT2277-1	WLCSP123	surface mount	bottom	WLCSP	4.95 x 4.395 x 0.525	123	silicon

Manufacture Code	Reference Codes	Issue Date
98ASA02243D		2025-03-05