SOT549-1: HTSSOP32


Overview

plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HTSSOP32 surface mount double HTSSOP 6.1 x 11 x 0.9 32 plastic
Manufacture Code Reference Codes Issue Date
SOT549 MO-153(JEDEC 2005-11-02
Part Description Quick access
Class D Audio Amplifier
UJA1075TW
UJA1076TW
High-speed CAN/dual LIN core system basis chip