SOT549-1: HTSSOP32

Overview

plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT549-1	HTSSOP32	surface mount	double	HTSSOP	6.1 x 11 x 0.9	32	plastic

Manufacture Code	Reference Codes	Issue Date
SOT549	MO-153(JEDEC)	2005-11-02

Products

Part	Description	Quick access
UJA1079ATW	LIN core system basis chip	View parametrics
TDA8933BTW	Class D Audio Amplifier	View parametrics
UJA1061TW	Fault-tolerant CAN/LIN fail-safe system basis chip	View parametrics
UJA1075ATW	High-speed CAN/ LIN core system basis chip	View parametrics
UJA1078ATW	High-speed CAN/dual LIN core system basis chip	View parametrics
UJA1076ATW	High-speed CAN core system basis chip	View parametrics
UJA1075TW	UJA1075TW	View parametrics
UJA1065TW	High-speed CAN/LIN fail-safe system basis chip	View parametrics
UJA1076TW	UJA1076TW	View parametrics
UJA1066TW	High-speed CAN fail-safe system basis chip	View parametrics
TDA8932BTW	Class-D audio amplifier	View parametrics
UJA1078TW	High-speed CAN/dual LIN core system basis chip	View parametrics
UJA1069TW	LIN fail-safe system basis chip	View parametrics