SOT549-1: HTSSOP32


Overview

plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HTSSOP32 surface mount double HTSSOP 6.1 x 11 x 0.9 32 plastic
Manufacture Code Reference Codes Issue Date
SOT549 MO-153(JEDEC) 2005-11-02
Part Description Quick access
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High-speed CAN/dual LIN core system basis chip
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UJA1075TW
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High-speed CAN/LIN fail-safe system basis chip
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