LIN 2.1 / SAEJ2602-2 Dual LIN Physical Layer

MC33663
No Longer Manufactured

  • MC33663 is not recommended for new designs. NXP® recommends TJA1022 be used in any new designs.

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The NXP MC33663 product line integrates two physical layers LIN buses dedicated to automotive LIN sub-bus applications.

  • The MC33663LEF and MC33663SEF devices offer normal baud rate (20kbps) and the MC33663JEF slow baud rate (10 kbps)
  • All devices integrate fast baud rate (above 100kbps) for test and programming modes
  • Excellent electromagnetic compatibility (EMC) and radiated emission performance, electrostatic discharge (ESD) robustness and safe behavior, in the event of LIN bus short-to-ground or LIN bus leakage during low-power mode

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N true 0 PSPMC33663en 3 Application Note Application Note t789 2 Data Sheet Data Sheet t520 1 en_US en_US en Data Sheet Data Sheet 1 1 2.0 English The 33663 product line integrates two physical layer LIN bus dedicated to automotive LIN sub-bus applications. 1340742472145720481515 PSP 873.5 KB None None documents None 1340742472145720481515 /docs/en/data-sheet/MC33663.pdf 873510 /docs/en/data-sheet/MC33663.pdf MC33663 documents N N 2012-06-26 MC33663, LIN 2.1 / SAEJ2602-2 Dual LIN Physical Layer - Data Sheet /docs/en/data-sheet/MC33663.pdf /docs/en/data-sheet/MC33663.pdf Data Sheet N 980000996212993340 2022-12-07 pdf N en Dec 19, 2013 980000996212993340 Data Sheet Y N MC33663, LIN 2.1 / SAEJ2602-2 Dual LIN Physical Layer - Data Sheet Application Note Application Note 2 2 3.0 English This application note provides guidelines for handling and assembly of SOIC package during Printed Circuit Board (PCB) assembly. 10jsBvfc PSP 3.5 MB None None documents None 10jsBvfc /docs/en/application-note/AN2409.pdf 3536520 /docs/en/application-note/AN2409.pdf AN2409 documents N N 2016-10-31 AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note /docs/en/application-note/AN2409.pdf /docs/en/application-note/AN2409.pdf Application Note N 645036621402383989 2024-01-19 pdf N en Oct 21, 2014 645036621402383989 Application Note Y N AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note 3 1.0 English The MC33781 and MC33784 together constitute NXP Semiconductors's implementation of the Distributed System Interface (DSI) Bus Standard, Version 2.02. 1225311007711718167766 PSP 1.0 MB None None documents None 1225311007711718167766 /docs/en/application-note/AN3670.pdf 1013814 /docs/en/application-note/AN3670.pdf AN3670 documents N N 2016-10-31 AN3670, Implementing a DSI Network Using the MC33781 and the MC33784 /docs/en/application-note/AN3670.pdf /docs/en/application-note/AN3670.pdf Application Note N 645036621402383989 2024-01-19 pdf N en Oct 29, 2008 645036621402383989 Application Note Y N AN3670, Implementing a DSI Network Using the MC33781 and the MC33784 false 0 MC33663 downloads en true 1 Y PSP Application Note 2 /docs/en/application-note/AN2409.pdf 2016-10-31 10jsBvfc PSP 2 Oct 21, 2014 Application Note This application note provides guidelines for handling and assembly of SOIC package during Printed Circuit Board (PCB) assembly. None /docs/en/application-note/AN2409.pdf English documents 3536520 None 645036621402383989 2024-01-19 N /docs/en/application-note/AN2409.pdf AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note /docs/en/application-note/AN2409.pdf documents 645036621402383989 Application Note N en None Y pdf 3.0 N N AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note 3.5 MB AN2409 N 10jsBvfc /docs/en/application-note/AN3670.pdf 2016-10-31 1225311007711718167766 PSP 3 Oct 29, 2008 Application Note The MC33781 and MC33784 together constitute NXP Semiconductors's implementation of the Distributed System Interface (DSI) Bus Standard, Version 2.02. None /docs/en/application-note/AN3670.pdf English documents 1013814 None 645036621402383989 2024-01-19 N /docs/en/application-note/AN3670.pdf AN3670, Implementing a DSI Network Using the MC33781 and the MC33784 /docs/en/application-note/AN3670.pdf documents 645036621402383989 Application Note N en None Y pdf 1.0 N N AN3670, Implementing a DSI Network Using the MC33781 and the MC33784 1.0 MB AN3670 N 1225311007711718167766 Data Sheet 1 /docs/en/data-sheet/MC33663.pdf 2012-06-26 1340742472145720481515 PSP 1 Dec 19, 2013 Data Sheet The 33663 product line integrates two physical layer LIN bus dedicated to automotive LIN sub-bus applications. None /docs/en/data-sheet/MC33663.pdf English documents 873510 None 980000996212993340 2022-12-07 N /docs/en/data-sheet/MC33663.pdf MC33663, LIN 2.1 / SAEJ2602-2 Dual LIN Physical Layer - Data Sheet /docs/en/data-sheet/MC33663.pdf documents 980000996212993340 Data Sheet N en None Y pdf 2.0 N N MC33663, LIN 2.1 / SAEJ2602-2 Dual LIN Physical Layer - Data Sheet 873.5 KB MC33663 N 1340742472145720481515 true Y Products

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