Documentation
Quick reference to our documentation types.
3 documents
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Application Note
AN3670, Implementing a DSI Network Using the MC33781 and the MC33784
- No Longer Manufactured
- MC33663 Dual LIN Physical Layer
LIN 2.1 / SAEJ2602-2 Dual LIN Physical Layer
MC33663 Receive alerts
- Not Recommended for New Designs
- This page contains information on a product that is not recommended for new designs.
MC33663 is not recommended for new designs. NXP® recommends TJA1022 be used in any new designs.
The NXP MC33663 product line integrates two physical layers LIN buses dedicated to automotive LIN sub-bus applications.
- The MC33663LEF and MC33663SEF devices offer normal baud rate (20kbps) and the MC33663JEF slow baud rate (10 kbps)
- All devices integrate fast baud rate (above 100kbps) for test and programming modes
- Excellent electromagnetic compatibility (EMC) and radiated emission performance, electrostatic discharge (ESD) robustness and safe behavior, in the event of LIN bus short-to-ground or LIN bus leakage during low-power mode
Design Resources
Engineering Services
To get further assistance directly from NXP, please see our Engineering Services.
1 engineering service
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Independent Design House (IDH)
Hardware Engineering Services
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Training
1 trainings
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On-Demand Webinar
Automotive Ethernet—Enabler of Future Connected Cars