LIN 2.1 / SAEJ2602-2 Dual LIN Physical Layer

  • Not Recommended for New Designs
  • MC33663 is not recommended for new designs. NXP® recommends TJA1022 be used in any new designs.

Package Quality

Environmental Information

Part Package Material Declaration Status PbFree EU RoHS Halogen Free RHF Indicator 2nd Level Interconnect REACH SVHC

Quality Information

Part Package Material Declaration Safe Assure Functional Safety Moisture Sensitivity Level (MSL) Peak Package Body Temperature(PPT)(℃) Maximum Time at Peak Temperature(s)
Lead Free Soldering Lead Free Soldering Lead Free Soldering