LIN Physical Interface

Overview

MC33399 is not recommended for new designs. NXP^® recommends TJA1021 be used in any new designs.

The NXP MC33399 is a physical layer component dedicated to automotive sub-bus applications.

Offers communication speed from 1.0kbps to 20kbps, and up to 60kbps for programming mode
Provides digital communications over multiple-node low to medium speed network
Waveshaping reduces EMI problems
Two operating modes: Normal and Sleep
Supports LIN protocol specification 1.3

Features

Nominal operation from VSUP 7.0 V to 18 V DC, functional up to 27 V DC battery voltage and capable of handling 40 V during load dump
Active bus waveshaping to minimize radiated emission
± 5.0 kV ESD on liN Bus Pin, ± 4.0 kV ESD on other pins
30 kΩ internal pull-up resistor
Ground shift operation and ground disconnection Fail-safe at the module level
An unpowered node does not disturb the network
20 μA in Sleep mode
Wake-up capability from liN Bus, MCU command and dedicated high voltage wake-up input (interface to external switch)
Interface to MCU with CMOS compatible I/O pins
Control of external voltage regulator

Nominal operation from VSUP 7.0 V to 18 V DC, functional up to 27 V DC battery voltage and capable of handling 40 V during load dump
Active bus waveshaping to minimize radiated emission
± 5.0 kV ESD on liN Bus Pin, ± 4.0 kV ESD on other pins
30 kΩ internal pull-up resistor
Ground shift operation and ground disconnection Fail-safe at the module level
An unpowered node does not disturb the network
20 μA in Sleep mode
Wake-up capability from liN Bus, MCU command and dedicated high voltage wake-up input (interface to external switch)
Interface to MCU with CMOS compatible I/O pins
Control of external voltage regulator

MPC5510KIT:Evaluation Kit for NXP’s MPC5510 Family

Evaluation and Development Boards

TWR-S12G240:MC9S12G240 Ultra Reliable 16-bit Tower System Module

Evaluation and Development Boards

MC33399: LIN Physical Interface ARCHIVED