LIN Physical Interface | NXP Semiconductors

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The NXP MC33399 is a physical layer component dedicated to automotive sub-bus applications.

Offers communication speed from 1.0kbps to 20kbps, and up to 60kbps for programming mode
Provides digital communications over multiple-node low to medium speed network
Waveshaping reduces EMI problems
Two operating modes: Normal and Sleep
Supports LIN protocol specification 1.3

Application Notes

Documentation

Quick reference to our documentation types

6 documents

Compact List

AN2409, Small Outline Integrated Circuit (SOIC) Package - Application Note[AN2409]

PDFOct 21, 2014Rev 3.0
AN3670, Implementing a DSI Network Using the MC33781 and the MC33784[AN3670]

PDFOct 29, 2008Rev 1.0
Car Door Keypad Using LIN[AN2205]

PDFJan 4, 2007Rev 2
AN2396, Servo Motor Control Application on a Local Area Interconnect Network (LIN)[AN2396]

PDFDec 15, 2005Rev 1

AN2396SW, Software files for AN2396[AN2396SW]

ZIPApr 18, 2003Rev 0

MC33399, Local Interconnect Network (LIN) Physical Interface - Data Sheet[MC33399]

PDFApr 11, 2013Rev 10.0

Design Resources

Design Files

Receive the full breakdown. See the product footprint and more in the eCad file.

Training

1 trainings

On-Demand
Automotive Ethernet—Enabler of Future Connected Cars

41 minEnglish Level: Beginner

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