Logic-Controlled High-Side Power Switch

  • This page contains information on a product that is no longer manufactured (discontinued). Specifications and information herein are available for historical reference only.

Block Diagram

NX3P190

NX3P190 Block Diagram

Features

Key Features

  • Wide supply voltage range from 1.1 V to 3.6 V
  • Very low ON resistance 95 mΩ (typical) at a supply voltage of 1.8 V
  • High noise immunity
  • Low-power mode when EN is LOW
  • Low ground current (2 µA maximum)
  • 1.2 V control logic at a supply voltage of 3.6 V
  • High current handling capability (500 mA continuous current)
  • Specified from -40 ℃ to +85 ℃

ESD Protection

  • HBM JESD22-A114F Class 3A exceeds 4000 V
  • CDM AEC-Q100-011 revision B exceeds 500 V

Buy/Parametrics










































































































N true 0 PSPNX3P190UKen 3 Application Note Application Note t789 2 Data Sheet Data Sheet t520 1 en_US en_US en Data Sheet Data Sheet 1 1 5.0 English 1442058209850694826185 PSP 1.0 MB None None documents None 1442058209850694826185 /docs/en/data-sheet/NX3P190.pdf 1008005 /docs/en/data-sheet/NX3P190.pdf NX3P190 documents N 2016-10-08 Logic controlled high-side power switch /docs/en/data-sheet/NX3P190.pdf /docs/en/data-sheet/NX3P190.pdf Data Sheet N 980000996212993340 2022-12-07 pdf en Feb 16, 2017 980000996212993340 Data Sheet N Logic controlled high-side power switch PDF Application Note Application Note 2 2 9.0 English This application note provides the guidelines for the use of Wafer-Level Packages (WLP) in fan-in and fan-out designs, using various bump attach processes with minimum bump pitches of 500 μm, 400 μm and 350 μm. 1442088844452695860837 PSP 3.5 MB Registration without Disclaimer None documents Extended 1442088844452695860837 /secured/assets/documents/en/application-note/AN10439.pdf 3465258 /secured/assets/documents/en/application-note/AN10439.pdf AN10439 documents Y N 2016-10-08 AN10439 – Wafer-level chip-scale package (fan-in WLP and fan-out WLP) – Application Note /webapp/Download?colCode=AN10439 /secured/assets/documents/en/application-note/AN10439.pdf Application Note N 645036621402383989 2024-04-23 pdf Y en Jan 27, 2022 645036621402383989 Application Note Y N AN10439 – Wafer-level chip-scale package (fan-in WLP and fan-out WLP) – Application Note PDF 3 1.0 English 1442089497659707315165 PSP 33.6 KB None None documents None 1442089497659707315165 /docs/en/application-note/AN11374.pdf 33579 /docs/en/application-note/AN11374.pdf AN11374 documents N 2016-10-08 Pin FMEA for NX3P switches /docs/en/application-note/AN11374.pdf /docs/en/application-note/AN11374.pdf Application Note N 645036621402383989 2022-12-07 pdf en Feb 15, 2017 645036621402383989 Application Note N Pin FMEA for NX3P switches PDF false 0 NX3P190UK downloads en true 1 Y PSP Application Note 2 /secured/assets/documents/en/application-note/AN10439.pdf 2016-10-08 1442088844452695860837 PSP 2 Jan 27, 2022 Application Note This application note provides the guidelines for the use of Wafer-Level Packages (WLP) in fan-in and fan-out designs, using various bump attach processes with minimum bump pitches of 500 μm, 400 μm and 350 μm. PDF Registration without Disclaimer /secured/assets/documents/en/application-note/AN10439.pdf English documents 3465258 None 645036621402383989 2024-04-23 Y /webapp/Download?colCode=AN10439 AN10439 – Wafer-level chip-scale package (fan-in WLP and fan-out WLP) – Application Note /secured/assets/documents/en/application-note/AN10439.pdf documents 645036621402383989 Application Note N en Extended Y pdf 9.0 Y N AN10439 – Wafer-level chip-scale package (fan-in WLP and fan-out WLP) – Application Note 3.5 MB AN10439 N 1442088844452695860837 /docs/en/application-note/AN11374.pdf 2016-10-08 1442089497659707315165 PSP 3 Feb 15, 2017 Application Note PDF None /docs/en/application-note/AN11374.pdf English documents 33579 None 645036621402383989 2022-12-07 /docs/en/application-note/AN11374.pdf Pin FMEA for NX3P switches /docs/en/application-note/AN11374.pdf documents 645036621402383989 Application Note N en None pdf 1.0 N Pin FMEA for NX3P switches 33.6 KB AN11374 N 1442089497659707315165 Data Sheet 1 /docs/en/data-sheet/NX3P190.pdf 2016-10-08 1442058209850694826185 PSP 1 Feb 16, 2017 Data Sheet PDF None /docs/en/data-sheet/NX3P190.pdf English documents 1008005 None 980000996212993340 2022-12-07 /docs/en/data-sheet/NX3P190.pdf Logic controlled high-side power switch /docs/en/data-sheet/NX3P190.pdf documents 980000996212993340 Data Sheet N en None pdf 5.0 N Logic controlled high-side power switch 1.0 MB NX3P190 N 1442058209850694826185 true Y Products

Documentation

Quick reference to our documentation types.

3 documents

Compact List

Design Files