The WLAN7201CC is a single monolithic, RF front-end IC available as a flip chip die with copper pillar bumps.
The WLAN7201CC is designed for Wi-Fi 6E and Wi-Fi 7 applications. It includes a power amplifier with directional coupler, a low noise receive amplifier (LNA) and a single pole double throw (SPDT) switch. The WLAN7201CC includes coexistence filters for both transmit and receive channels.
The device is matched to 50 Ω and integrates harmonic and out of band filtering which minimizes the layout area in the application.
Note: To prevent reliability issues of Cu-pillar products. It is mandatory to select a molded underfill material (MUF) with less than 20 ppm chlorides as per the material supplier specifications.