A3G20S350-01SR3

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of A3G20S350-01SR3Last Revision (GMT):
Thursday, 14 April 2022, 02:31:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
A3G20S350-01SR3SOT1828CFM2F579.531189 mg YesYesYesN/ANot Applicablee4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 093 141182020-08-112NA / Not Available26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.19996999.9900000.034505
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000200.0100000.000003
Subtotal0.199989100.00000000.034509
CapCapAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-1501.39672595.08870086.517643
Epoxy ResinsEpoxy resin, EPON Resin 809125928-94-31.9182950.3638000.331008
Inorganic Silicon compoundsProprietary Material-Other glass compounds (without lead, chromium, cadmium or mercury)5.1553500.9777000.889573
Inorganic Silicon compoundsQuartz14808-60-718.8233313.5698003.248027
Subtotal527.293700100.000000090.986251
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsProprietary Material-Other Epoxy resins0.4591803.0612000.079233
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.4591803.0612000.079233
Silver and its compoundsSilver, metal7440-22-414.08164093.8776002.429833
Subtotal15.000000100.00000002.588299
Header Assembly/FlangeHeader Assembly/FlangeAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.0898208.9820000.015499
Chromium and Chromium III compoundsChromium, metal7440-47-30.0001920.0192000.000033
Cobalt and its compoundsCobalt, metal7440-48-40.0065920.6592000.001138
Copper and its compoundsCopper, metal7440-50-80.66641266.6412000.114992
Gold and its compoundsGold, metal7440-57-50.0148091.4809000.002555
Inorganic Silicon compoundsQuartz14808-60-70.0001910.0191000.000033
Iron and its compoundsIron, metal7439-89-60.0407014.0701000.007023
Manganese and its compoundsManganese, metal7439-96-50.0005740.0574000.000099
Molybdenum and its compoundsMolybdenum, metal7439-98-70.10261310.2613000.017706
Nickel and its compoundsNickel, metal7440-02-00.0577085.7708000.009958
Organic compoundsbeta-Terpineol8000-41-70.0004780.0478000.000082
PolymersEthyl cellulose9004-57-30.0000950.0095000.000016
Silver and its compoundsSilver, metal7440-22-40.0197771.9777000.003413
Titanium and its compoundsTitanium (IV) Oxide13463-67-70.0000380.0038000.000007
Subtotal1.000000100.00000000.172553
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon, doped27.46940098.0000004.739935
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.5606002.0000000.096733
Subtotal28.030000100.00000004.836668
Semiconductor Die 2Semiconductor DieGold and its compoundsGold, metal7440-57-50.0714761.0200000.012334
Inorganic Silicon compoundsSilicon7440-21-36.79730397.0004001.172897
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1387201.9796000.023937
Subtotal7.007500100.00000001.209167
Semiconductor Die 3Semiconductor DieGold and its compoundsGold, metal7440-57-50.0102001.0200000.001760
Inorganic Silicon compoundsSilicon7440-21-30.97000497.0004000.167377
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0197961.9796000.003416
Subtotal1.000000100.00000000.172553
Total579.531189100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 A3G20S350-01SR3
Product content declaration of A3G20S350-01SR3
上次修订 Last Revision (GMT):
Thursday, 14 April 2022, 02:31:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
盖子
Cap
盖子
Cap
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装焊头/法兰
Header Assembly/Flange
封装焊头/法兰
Header Assembly/Flange
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of A3G20S350-01SR3Last Revision (GMT):
Thursday, 14 April 2022, 02:31:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
19 Apr 2021
Test Report
19 Apr 2021
Test Report
19 Apr 2021
Test Report
19 Apr 2021
CapCERAMICTest Report
30 Jun 2021
Test Report
30 Jun 2021
Test Report
30 Jun 2021
Test Report
27 Jun 2019
EPOXYTest Report
30 Jun 2021
Test Report
30 Jun 2021
Test Report
27 Jun 2019
Not Available
Epoxy AdhesiveTest Report
28 Jul 2020
Test Report
28 Jul 2020
Test Report
28 Jul 2020
Test Report
28 Jul 2020
Header Assembly/FlangeNot AvailableNot AvailableNot AvailableNot Available
Semiconductor Die 1Test Report
9 Sep 2021
Test Report
9 Sep 2021
Test Report
9 Sep 2021
Test Report
9 Sep 2021
Semiconductor Die 2Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Semiconductor Die 3Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.