A3M40PD012T7

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of A3M40PD012T7Last Revision (GMT):
Tuesday, 16 April 2024, 08:34:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
A3M40PD012T7SOT2008HLFLGA127.989000 mg YesYesYesNickel/Palladium/Gold (Ni/Pd/Au)Othere4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 118 325472023-11-2433 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum Hydroxide21645-51-20.0609841.4000000.763350
Epoxy ResinsOther Epoxy resins0.2482925.7000003.107923
Inorganic Silicon compoundsQuartz14808-60-70.0217800.5000000.272625
Inorganic Silicon compoundsSilica, vitreous60676-86-02.57875259.20000032.278783
Inorganic Silicon compoundsSilicon dioxide7631-86-91.30680030.00000016.357492
Inorganic compoundsCarbon Black1333-86-40.0174240.4000000.218100
Phenols and Phenolic ResinsOther phenolic resins0.1219682.8000001.526699
Subtotal4.356000100.000000054.524972
Semiconductor DieSemiconductor DieCopper and its compoundsCopper, metal7440-50-80.0023480.3800000.029395
Inorganic Silicon compoundsSilicon7440-21-30.60120397.2820007.525382
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0122671.9850000.153552
Nickel and its compoundsNickel, metal7440-02-00.0000120.0020000.000155
Silver and its compoundsSilver, metal7440-22-40.0000370.0060000.000464
Tin and its compoundsTin, metal7440-31-50.0021070.3410000.026378
Titanium and its compoundsTitanium, metal7440-32-60.0000250.0040000.000309
Subtotal0.618000100.00000007.735636
Substrate, Pre-plated NiPdAuSubstrate, Pre-plated NiPdAuBarium and its compoundsBarium sulfate7727-43-70.1300974.3150001.628455
Copper and its compoundsCopper, metal7440-50-81.64827054.66900020.631748
Epoxy ResinsOther Epoxy resins0.53781617.8380006.731953
Gold and its compoundsGold, metal7440-57-50.0026830.0890000.033588
Inorganic Silicon compoundsFibrous-glass-wool65997-17-30.50311316.6870006.297572
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0650342.1570000.814039
Magnesium and its compoundsTalc14807-96-60.0182110.6040000.227946
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0183010.6070000.229078
Nickel and its compoundsNickel, metal7440-02-00.0901182.9890001.128030
Palladium and its compoundsPalladium, metal7440-05-30.0013570.0450000.016983
Subtotal3.015000100.000000037.739392
Total7.989000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 A3M40PD012T7
Product content declaration of A3M40PD012T7
上次修订 Last Revision (GMT):
Tuesday, 16 April 2024, 08:34:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
基板,预镀镍钯金
Substrate, Pre-plated NiPdAu
基板,预镀镍钯金
Substrate, Pre-plated NiPdAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of A3M40PD012T7Last Revision (GMT):
Tuesday, 16 April 2024, 08:34:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Die EncapsulantTest Report
30 Nov 2023
Test Report
30 Nov 2023
Test Report
30 Nov 2023
Test Report
30 Nov 2023
Semiconductor DieCOPPERTest Report
19 Jan 2024
Test Report
19 Jan 2024
Test Report
19 Jan 2024
Test Report
19 Jan 2024
DIETest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
LEAD FREE BUMPTest Report
13 Jul 2022
Test Report
13 Jul 2022
Test Report
13 Jul 2022
Test Report
13 Jul 2022
TITANIUMTest Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
Test Report
18 Jan 2023
Substrate, Pre-plated NiPdAuAU PLATINGTest Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
AUS SR-1Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
CORENot AvailableNot AvailableNot AvailableNot Available
CU FOILNot AvailableNot AvailableNot AvailableNot Available
CU PLATINGTest Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
NI PLATINGTest Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
Test Report
2 Jan 2024
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.