A3T18H360W23SR6

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of A3T18H360W23SR6Last Revision (GMT):
Wednesday, 24 July 2024, 06:21:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
A3T18H360W23SR6SOT1800-4ACP-1230S-4L2S6295.436081 mg YesYesYesNickel/Palladium/Gold (Ni/Pd/Au)Cu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 463 541282024-07-0910NA / Not Available26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AlBonding Wire - AlAluminum and its compoundsAluminum, metal7429-90-5175.92787198.8450002.794530
Inorganic Silicon compoundsSilicon7440-21-32.0468111.1500000.032513
Nickel and its compoundsNickel, metal7440-02-00.0088990.0050000.000141
Subtotal177.983581100.00000002.827184
CapCapGuanidine compounds1-cyanoguanidine461-58-51.0018400.1400000.015914
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.9016560.1260000.014322
Organic Silicon compounds[3-(2,3-epoxypropoxy)propyl]trimethoxysilane2530-83-80.1001840.0140000.001591
Organic compounds3,3'-(4-Methylbenzene-1,3-diyl)bis(1,1-dimethylurea)17526-94-20.5009200.0700000.007957
PolymersAcrylonitrile-methyl-methacrylate-vinylidene chloride copolymer25036-25-33.0055200.4200000.047741
PolymersBisphenol A, formaldehyde, epichlorohydrin polymer28906-96-94.0073600.5600000.063655
PolymersProprietary Material-Other acrylic/epoxy resin mixture705.58160098.60000011.207827
Titanium and its compoundsTitanium dioxide1317-70-00.5009200.0700000.007957
Subtotal715.600000100.000000011.366965
Copper Lead-Frame, Pre-Plated NiPdAuCopper Lead-Frame, Pre-Plated NiPdAuCopper and its compoundsCopper, metal7440-50-8275.24697864.6575004.372167
Gold and its compoundsGold, metal7440-57-50.0170280.0040000.000271
Guanidine compounds1-cyanoguanidine461-58-50.8088300.1900000.012848
Inorganic Silicon compoundsSilicon7440-21-32.0957210.4923000.033289
Iron and its compoundsIron, metal7439-89-60.2890500.0679000.004591
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0723690.0170000.001149
Magnesium and its compoundsMagnesium, metal7439-95-40.5057320.1188000.008033
Manganese and its compoundsManganese, metal7439-96-50.1447380.0340000.002299
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.7279470.1710000.011563
Nickel and its compoundsNickel, metal7440-02-011.6292732.7318000.184725
Organic Silicon compounds[3-(2,3-epoxypropoxy)propyl]trimethoxysilane2530-83-80.0808830.0190000.001285
Organic compounds3,3'-(4-Methylbenzene-1,3-diyl)bis(1,1-dimethylurea)17526-94-20.4044150.0950000.006424
Palladium and its compoundsPalladium, metal7440-05-30.1613400.0379000.002563
PolymersAcrylonitrile-methyl-methacrylate-vinylidene chloride copolymer25036-25-32.4264900.5700000.038544
PolymersBisphenol A, formaldehyde, epichlorohydrin polymer28906-96-93.2353200.7600000.051391
PolymersProprietary Material-Other acrylic/epoxy resin mixture126.00422029.5993002.001517
Titanium and its compoundsTitanium dioxide1317-70-00.4044150.0950000.006424
Zinc and its compoundsZinc, metal7440-66-61.4452510.3395000.022957
Subtotal425.700000100.00000006.762041
Header Assembly/FlangeHeader Assembly/FlangeCobalt and its compoundsCobalt, metal7440-48-421.0972260.4497000.335119
Copper and its compoundsCopper, metal7440-50-84608.97210298.24300073.211324
Gold and its compoundsGold, metal7440-57-519.4458530.4145000.308888
Nickel and its compoundsNickel, metal7440-02-037.3107040.7953000.592663
Zirconium and its compoundsZirconium, metal7440-67-74.5741150.0975000.072658
Subtotal4691.400000100.000000074.520652
Semiconductor Die 1Semiconductor DieGold and its compoundsGold, metal7440-57-50.0716041.0200000.001137
Inorganic Silicon compoundsSilicon, doped6.80942897.0004000.108164
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1389681.9796000.002207
Subtotal7.020000100.00000000.111509
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon, doped63.02625098.0000001.001142
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.2862502.0000000.020431
Subtotal64.312500100.00000001.021573
Semiconductor Die 3Semiconductor DieGold and its compoundsGold, metal7440-57-50.0716041.0200000.001137
Inorganic Silicon compoundsSilicon, doped6.80942897.0004000.108164
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1389681.9796000.002207
Subtotal7.020000100.00000000.111509
Semiconductor Die 4Semiconductor DieGold and its compoundsGold, metal7440-57-51.5636601.0200000.024838
Inorganic Silicon compoundsSilicon, doped148.70161397.0004002.362054
Miscellaneous substancesOther miscellaneous substances (less than 10%).3.0347271.9796000.048205
Subtotal153.300000100.00000002.435097
Semiconductor Die 5Semiconductor DieInorganic Silicon compoundsSilicon, doped6.17400098.0000000.098071
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1260002.0000000.002001
Subtotal6.300000100.00000000.100072
Semiconductor Die 6Semiconductor DieGold and its compoundsGold, metal7440-57-50.4773601.0200000.007583
Inorganic Silicon compoundsSilicon, doped45.39618797.0004000.721097
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.9264531.9796000.014716
Subtotal46.800000100.00000000.743396
Total6295.436081100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 A3T18H360W23SR6
Product content declaration of A3T18H360W23SR6
上次修订 Last Revision (GMT):
Wednesday, 24 July 2024, 06:21:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铝
Bonding Wire - Al
焊丝-铝
Bonding Wire - Al
OOOOOO
盖子
Cap
盖子
Cap
OOOOOO
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
OOOOOO
封装焊头/法兰
Header Assembly/Flange
封装焊头/法兰
Header Assembly/Flange
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 4
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 5
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 6
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of A3T18H360W23SR6Last Revision (GMT):
Wednesday, 24 July 2024, 06:21:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AlTest Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
CapEPOXYTest Report
30 Jun 2021
Test Report
30 Jun 2021
Test Report
13 Mar 2020
Not Available
LCPTest Report
30 Mar 2020
Test Report
30 Mar 2020
Test Report
30 Mar 2020
Not Available
Copper Lead-Frame, Pre-Plated NiPdAuC7025 + NIPDAUTest Report
15 Feb 2022
Test Report
15 Feb 2022
Test Report
15 Feb 2022
Test Report
15 Feb 2022
EPOXYTest Report
13 Mar 2020
Test Report
13 Mar 2020
Test Report
13 Mar 2020
Not Available
LCPTest Report
13 Mar 2020
Test Report
13 Mar 2020
Test Report
13 Mar 2020
Not Available
Header Assembly/FlangeCDA 151Test Report
21 Feb 2023
Test Report
21 Feb 2023
Test Report
21 Feb 2023
Test Report
21 Feb 2023
CU NICO AU PLATINGTest Report
21 Feb 2023
Test Report
21 Feb 2023
Test Report
21 Feb 2023
Test Report
21 Feb 2023
Semiconductor Die 1Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Semiconductor Die 2Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Semiconductor Die 3Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Semiconductor Die 4Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Semiconductor Die 5Not AvailableNot AvailableNot AvailableNot Available
Semiconductor Die 6Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.