A3T21H455W23SR6

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of A3T21H455W23SR6Last Revision (GMT):
Friday, 08 March 2024, 08:27:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
A3T21H455W23SR6SOT1800CFM6F6126.953801 mg YesYesYesNickel/Palladium/Gold (Ni/Pd/Au)Cu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 683 161282024-01-0311NA / Not Available26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AlBonding Wire - AlAluminum and its compoundsAluminum, metal7429-90-5175.92787198.8450002.871376
Inorganic Silicon compoundsSilicon7440-21-32.0468111.1500000.033407
Nickel and its compoundsNickel, metal7440-02-00.0088990.0050000.000145
Subtotal177.983581100.00000002.904928
CapCapGuanidine compounds1-cyanoguanidine461-58-51.0018400.1400000.016351
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.9016560.1260000.014716
Organic Silicon compounds[3-(2,3-epoxypropoxy)propyl]trimethoxysilane2530-83-80.1001840.0140000.001635
Organic compounds3,3'-(4-Methylbenzene-1,3-diyl)bis(1,1-dimethylurea)17526-94-20.5009200.0700000.008176
PolymersAcrylonitrile-methyl-methacrylate-vinylidene chloride copolymer25036-25-33.0055200.4200000.049054
PolymersBisphenol A, formaldehyde, epichlorohydrin polymer28906-96-94.0073600.5600000.065405
PolymersProprietary Material-Other acrylic/epoxy resin mixture705.58160098.60000011.516026
Titanium and its compoundsTitanium dioxide1317-70-00.5009200.0700000.008176
Subtotal715.600000100.000000011.679540
Copper Lead-Frame, Pre-Plated NiPdAuCopper Lead-Frame, Pre-Plated NiPdAuCopper and its compoundsCopper, metal7440-50-8275.24697864.6575004.492395
Gold and its compoundsGold, metal7440-57-50.0170280.0040000.000278
Guanidine compounds1-cyanoguanidine461-58-50.8088300.1900000.013201
Inorganic Silicon compoundsSilicon7440-21-32.0957210.4923000.034205
Iron and its compoundsIron, metal7439-89-60.2890500.0679000.004718
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0723690.0170000.001181
Magnesium and its compoundsMagnesium, metal7439-95-40.5057320.1188000.008254
Manganese and its compoundsManganese, metal7439-96-50.1447380.0340000.002362
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.7279470.1710000.011881
Nickel and its compoundsNickel, metal7440-02-011.6292732.7318000.189805
Organic Silicon compounds[3-(2,3-epoxypropoxy)propyl]trimethoxysilane2530-83-80.0808830.0190000.001320
Organic compounds3,3'-(4-Methylbenzene-1,3-diyl)bis(1,1-dimethylurea)17526-94-20.4044150.0950000.006601
Palladium and its compoundsPalladium, metal7440-05-30.1613400.0379000.002633
PolymersAcrylonitrile-methyl-methacrylate-vinylidene chloride copolymer25036-25-32.4264900.5700000.039603
PolymersBisphenol A, formaldehyde, epichlorohydrin polymer28906-96-93.2353200.7600000.052805
PolymersProprietary Material-Other acrylic/epoxy resin mixture126.00422029.5993002.056556
Titanium and its compoundsTitanium dioxide1317-70-00.4044150.0950000.006601
Zinc and its compoundsZinc, metal7440-66-61.4452510.3395000.023588
Subtotal425.700000100.00000006.947988
Header Assembly/FlangeHeader Assembly/FlangeCobalt and its compoundsCobalt, metal7440-48-421.0972260.4497000.344335
Copper and its compoundsCopper, metal7440-50-84608.97210298.24300075.224528
Gold and its compoundsGold, metal7440-57-519.4458530.4145000.317382
Nickel and its compoundsNickel, metal7440-02-037.3107040.7953000.608960
Zirconium and its compoundsZirconium, metal7440-67-74.5741150.0975000.074656
Subtotal4691.400000100.000000076.569861
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon, doped73.37281698.0000001.197542
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.4974042.0000000.024440
Subtotal74.870220100.00000001.221981
Semiconductor Die 2Semiconductor DieGold and its compoundsGold, metal7440-57-50.0716041.0200000.001169
Inorganic Silicon compoundsSilicon, doped6.80942897.0004000.111139
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1389681.9796000.002268
Subtotal7.020000100.00000000.114576
Semiconductor Die 3Semiconductor DieGold and its compoundsGold, metal7440-57-50.0716041.0200000.001169
Inorganic Silicon compoundsSilicon, doped6.80942897.0004000.111139
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1389681.9796000.002268
Subtotal7.020000100.00000000.114576
Semiconductor Die 4Semiconductor DieInorganic Silicon compoundsSilicon, doped6.87960098.0000000.112284
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1404002.0000000.002292
Subtotal7.020000100.00000000.114576
Semiconductor Die 5Semiconductor DieGold and its compoundsGold, metal7440-57-50.1432081.0200000.002337
Inorganic Silicon compoundsSilicon, doped13.61885697.0004000.222278
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2779361.9796000.004536
Subtotal14.040000100.00000000.229151
Semiconductor Die 6Semiconductor DieInorganic Silicon compoundsSilicon, doped6.17400098.0000000.100768
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1260002.0000000.002057
Subtotal6.300000100.00000000.102824
Total6126.953801100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 A3T21H455W23SR6
Product content declaration of A3T21H455W23SR6
上次修订 Last Revision (GMT):
Friday, 08 March 2024, 08:27:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铝
Bonding Wire - Al
焊丝-铝
Bonding Wire - Al
OOOOOO
盖子
Cap
盖子
Cap
OOOOOO
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
OOOOOO
封装焊头/法兰
Header Assembly/Flange
封装焊头/法兰
Header Assembly/Flange
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 4
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 5
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 6
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of A3T21H455W23SR6Last Revision (GMT):
Friday, 08 March 2024, 08:27:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AlTest Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
Test Report
18 Sep 2023
CapEPOXYTest Report
30 Jun 2021
Test Report
30 Jun 2021
Test Report
13 Mar 2020
Not Available
LCPTest Report
30 Mar 2020
Test Report
30 Mar 2020
Test Report
30 Mar 2020
Not Available
Copper Lead-Frame, Pre-Plated NiPdAuC7025 + NIPDAUTest Report
15 Feb 2022
Test Report
15 Feb 2022
Test Report
15 Feb 2022
Test Report
15 Feb 2022
EPOXYTest Report
13 Mar 2020
Test Report
13 Mar 2020
Test Report
13 Mar 2020
Not Available
LCPTest Report
13 Mar 2020
Test Report
13 Mar 2020
Test Report
13 Mar 2020
Not Available
Header Assembly/FlangeCDA 151Test Report
21 Feb 2023
Test Report
21 Feb 2023
Test Report
21 Feb 2023
Test Report
21 Feb 2023
CU NICO AU PLATINGTest Report
21 Feb 2023
Test Report
21 Feb 2023
Test Report
21 Feb 2023
Test Report
21 Feb 2023
Semiconductor Die 1Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Semiconductor Die 2Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Semiconductor Die 3Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Semiconductor Die 4Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Semiconductor Die 5Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Semiconductor Die 6Not AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.