A5G18H610W19NR3

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of A5G18H610W19NR3Last Revision (GMT):
Tuesday, 07 May 2024, 04:13:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
A5G18H610W19NR3SOT2082FM8F3182.125572 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 571 245282023-12-1363 / 168 hours24530 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuWireGold and its compoundsGold, metal7440-57-514.94457799.9900000.469641
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0014950.0100000.000047
Subtotal14.946072100.00000000.469688
Copper Lead-Frame, Pre-Plated AgCopper AlloyCopper and its compoundsCopper, metal7440-50-81393.80752297.29100043.801148
Iron and its compoundsIron, metal7439-89-633.9530262.3700001.066992
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.2435450.0170000.007653
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-02.3781440.1660000.074734
Tin and its compoundsTin, metal7440-31-50.4297850.0300000.013506
Zinc and its compoundsZinc, metal7440-66-61.8050980.1260000.056726
Subtotal1432.617120100.000000045.020760
Silver PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0014470.0100000.000046
Silver and its compoundsSilver, metal7440-22-414.46943399.9900000.454710
Subtotal14.470880100.00000000.454755
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins89.7690007.5000002.821039
Inorganic Silicon compoundsSilica, vitreous60676-86-01041.32040087.00000032.724051
Inorganic Silicon compoundsSilicon dioxide7631-86-929.9230002.5000000.940346
Inorganic compoundsCarbon Black1333-86-45.9846000.5000000.188069
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins29.9230002.5000000.940346
Subtotal1196.920000100.000000037.613852
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsProprietary Material-Other Epoxy resins0.2511413.0612000.007892
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.2511413.0612000.007892
Silver and its compoundsSilver, metal7440-22-47.70171893.8776000.242031
Subtotal8.204000100.00000000.257815
Header Assembly/FlangeFlangeCopper and its compoundsCopper, metal7440-50-8343.75046485.64000010.802542
Molybdenum and its compoundsMolybdenum, metal7439-98-757.63961514.3600001.811356
Subtotal401.390080100.000000012.613898
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0001610.1000000.000005
Silver and its compoundsSilver, metal7440-22-40.16046099.9000000.005043
Subtotal0.160620100.00000000.005047
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0194660.0200000.000612
Tin and its compoundsTin, metal7440-31-597.30853499.9800003.057973
Subtotal97.328000100.00000003.058584
Semiconductor Die 1DieInorganic Silicon compoundsSilicon carbide409-21-21.61893295.2000000.050876
Inorganic compoundsGallium nitride25617-97-40.0629213.7000000.001977
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0187061.1000000.000588
Subtotal1.700559100.00000000.053441
Metallization LayerGold and its compoundsGold, metal7440-57-50.98164798.2884000.030849
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0010000.1001000.000031
Nickel and its compoundsNickel, metal7440-02-00.0059970.6005000.000189
Titanium and its compoundsTitanium, metal7440-32-60.0050990.5105000.000160
Tungsten and its compoundsTungsten, metal7440-33-70.0049990.5005000.000157
Subtotal0.998741100.00000000.031386
Semiconductor Die 2DieInorganic Silicon compoundsSilicon carbide409-21-21.57395095.2000000.049462
Inorganic compoundsGallium nitride25617-97-40.0611723.7000000.001922
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0181861.1000000.000571
Subtotal1.653309100.00000000.051956
Metallization LayerGold and its compoundsGold, metal7440-57-50.95437298.2884000.029992
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0009720.1001000.000030
Nickel and its compoundsNickel, metal7440-02-00.0058310.6005000.000183
Titanium and its compoundsTitanium, metal7440-32-60.0049570.5105000.000156
Tungsten and its compoundsTungsten, metal7440-33-70.0048600.5005000.000153
Subtotal0.970991100.00000000.030514
Semiconductor Die 3Semiconductor DieGold and its compoundsGold, metal7440-57-50.0274511.0200000.000863
Inorganic Silicon compoundsSilicon7440-21-32.61057297.0004000.082039
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0532771.9796000.001674
Subtotal2.691300100.00000000.084576
Semiconductor Die 4Semiconductor DieGold and its compoundsGold, metal7440-57-50.0274511.0200000.000863
Inorganic Silicon compoundsSilicon7440-21-32.61057297.0004000.082039
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0532771.9796000.001674
Subtotal2.691300100.00000000.084576
Semiconductor Die 5Semiconductor DieGold and its compoundsGold, metal7440-57-50.0274511.0200000.000863
Inorganic Silicon compoundsSilicon7440-21-32.61057297.0004000.082039
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0532771.9796000.001674
Subtotal2.691300100.00000000.084576
Semiconductor Die 6Semiconductor DieGold and its compoundsGold, metal7440-57-50.0274511.0200000.000863
Inorganic Silicon compoundsSilicon7440-21-32.61057297.0004000.082039
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0532771.9796000.001674
Subtotal2.691300100.00000000.084576
Total3182.125572100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 A5G18H610W19NR3
Product content declaration of A5G18H610W19NR3
上次修订 Last Revision (GMT):
Tuesday, 07 May 2024, 04:13:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
线
Wire
OOOOOO
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装焊头/法兰
Header Assembly/Flange
法兰盘
Flange
OOOOOO

镀银
Silver Plating
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Die
OOOOOO

金属化层
Metallization Layer
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Die
OOOOOO

金属化层
Metallization Layer
OOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 4
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 5
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 6
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of A5G18H610W19NR3Last Revision (GMT):
Tuesday, 07 May 2024, 04:13:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
24 Apr 2023
Test Report
24 Apr 2023
Test Report
24 Apr 2023
Test Report
24 Apr 2023
Copper Lead-Frame, Pre-Plated AgCDA 194Test Report
21 Feb 2023
Test Report
21 Feb 2023
Test Report
21 Feb 2023
Not Available
Die EncapsulantTest Report
17 Apr 2024
Test Report
17 Apr 2024
Test Report
17 Apr 2024
Test Report
17 Apr 2024
Epoxy AdhesiveTest Report
28 Jul 2023
Test Report
28 Jul 2023
Test Report
28 Jul 2023
Test Report
28 Jul 2023
Header Assembly/FlangeTest Report
9 Dec 2022
Test Report
9 Dec 2022
Test Report
9 Dec 2022
Test Report
9 Dec 2022
Post-plating - Lead FreeTest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Semiconductor Die 1Not AvailableNot AvailableNot AvailableNot Available
Semiconductor Die 2Test Report
28 May 2024
Test Report
28 May 2024
Test Report
28 May 2024
Test Report
28 May 2024
Semiconductor Die 3AU BUMPINGNot AvailableNot AvailableNot AvailableNot Available
DIENot AvailableNot AvailableNot AvailableNot Available
Semiconductor Die 4AU BUMPINGNot AvailableNot AvailableNot AvailableNot Available
DIENot AvailableNot AvailableNot AvailableNot Available
Semiconductor Die 5AU BUMPINGNot AvailableNot AvailableNot AvailableNot Available
DIENot AvailableNot AvailableNot AvailableNot Available
Semiconductor Die 6AU BUMPINGNot AvailableNot AvailableNot AvailableNot Available
DIENot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.