A5G26H605W19NR3

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of A5G26H605W19NR3Last Revision (GMT):
Monday, 05 August 2024, 08:10:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
A5G26H605W19NR3SOT2082FM8F3093.889402 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 611 335282024-07-1963 / 168 hours24530 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuWireGold and its compoundsGold, metal7440-57-514.94457799.9900000.483035
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0014950.0100000.000048
Subtotal14.946072100.00000000.483084
Copper Lead-Frame, Pre-Plated AgCopper AlloyCopper and its compoundsCopper, metal7440-50-81393.80752297.29100045.050334
Iron and its compoundsIron, metal7439-89-633.9530262.3700001.097422
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.2435450.0170000.007872
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-02.3781440.1660000.076866
Tin and its compoundsTin, metal7440-31-50.4297850.0300000.013891
Zinc and its compoundsZinc, metal7440-66-61.8050980.1260000.058344
Subtotal1432.617120100.000000046.304730
Silver PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0014470.0100000.000047
Silver and its compoundsSilver, metal7440-22-414.46943399.9900000.467678
Subtotal14.470880100.00000000.467725
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins89.7690007.5000002.901493
Inorganic Silicon compoundsSilica, vitreous60676-86-01041.32040087.00000033.657325
Inorganic Silicon compoundsSilicon dioxide7631-86-929.9230002.5000000.967164
Inorganic compoundsCarbon Black1333-86-45.9846000.5000000.193433
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins29.9230002.5000000.967164
Subtotal1196.920000100.000000038.686580
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsProprietary Material-Other Epoxy resins0.0306123.0612000.000989
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.0306123.0612000.000989
Silver and its compoundsSilver, metal7440-22-40.93877693.8776000.030343
Subtotal1.000000100.00000000.032322
Header Assembly/FlangeFlangeCopper and its compoundsCopper, metal7440-50-8343.75046485.64000011.110625
Molybdenum and its compoundsMolybdenum, metal7439-98-757.63961514.3600001.863015
Subtotal401.390080100.000000012.973640
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0001610.1000000.000005
Silver and its compoundsSilver, metal7440-22-40.16046099.9000000.005186
Subtotal0.160620100.00000000.005191
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0002000.0200000.000006
Tin and its compoundsTin, metal7440-31-50.99980099.9800000.032315
Subtotal1.000000100.00000000.032322
Semiconductor Die 1DieInorganic Silicon compoundsSilicon carbide409-21-21.61893295.2000000.052327
Inorganic compoundsGallium nitride25617-97-40.0629213.7000000.002034
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0187061.1000000.000605
Subtotal1.700559100.00000000.054965
Metallization LayerGold and its compoundsGold, metal7440-57-50.98164798.2884000.031729
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0010000.1001000.000032
Nickel and its compoundsNickel, metal7440-02-00.0059970.6005000.000194
Titanium and its compoundsTitanium, metal7440-32-60.0050990.5105000.000165
Tungsten and its compoundsTungsten, metal7440-33-70.0049990.5005000.000162
Subtotal0.998741100.00000000.032281
Semiconductor Die 2DieInorganic Silicon compoundsSilicon carbide409-21-20.39304195.2000000.012704
Inorganic compoundsGallium nitride25617-97-40.0152763.7000000.000494
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0045411.1000000.000147
Subtotal0.412858100.00000000.013344
Metallization LayerGold and its compoundsGold, metal7440-57-50.23832298.2884000.007703
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0002430.1001000.000008
Nickel and its compoundsNickel, metal7440-02-00.0014560.6005000.000047
Titanium and its compoundsTitanium, metal7440-32-60.0012380.5105000.000040
Tungsten and its compoundsTungsten, metal7440-33-70.0012140.5005000.000039
Subtotal0.242472100.00000000.007837
Semiconductor Die 3Semiconductor DieGold and its compoundsGold, metal7440-57-50.0714761.0200000.002310
Inorganic Silicon compoundsSilicon7440-21-36.79730397.0004000.219701
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1387201.9796000.004484
Subtotal7.007500100.00000000.226495
Semiconductor Die 4Semiconductor DieGold and its compoundsGold, metal7440-57-50.0714761.0200000.002310
Inorganic Silicon compoundsSilicon7440-21-36.79730397.0004000.219701
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1387201.9796000.004484
Subtotal7.007500100.00000000.226495
Semiconductor Die 5Semiconductor DieGold and its compoundsGold, metal7440-57-50.0714761.0200000.002310
Inorganic Silicon compoundsSilicon7440-21-36.79730397.0004000.219701
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1387201.9796000.004484
Subtotal7.007500100.00000000.226495
Semiconductor Die 6Semiconductor DieGold and its compoundsGold, metal7440-57-50.0714761.0200000.002310
Inorganic Silicon compoundsSilicon7440-21-36.79730397.0004000.219701
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1387201.9796000.004484
Subtotal7.007500100.00000000.226495
Total3093.889402100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 A5G26H605W19NR3
Product content declaration of A5G26H605W19NR3
上次修订 Last Revision (GMT):
Monday, 05 August 2024, 08:10:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
线
Wire
OOOOOO
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装焊头/法兰
Header Assembly/Flange
法兰盘
Flange
OOOOOO

镀银
Silver Plating
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Die
OOOOOO

金属化层
Metallization Layer
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Die
OOOOOO

金属化层
Metallization Layer
OOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 4
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 5
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 6
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of A5G26H605W19NR3Last Revision (GMT):
Monday, 05 August 2024, 08:10:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
24 Apr 2023
Test Report
24 Apr 2023
Test Report
24 Apr 2023
Test Report
24 Apr 2023
Copper Lead-Frame, Pre-Plated AgCDA 194Test Report
21 Feb 2023
Test Report
21 Feb 2023
Test Report
21 Feb 2023
Not Available
Die EncapsulantTest Report
17 Apr 2024
Test Report
17 Apr 2024
Test Report
17 Apr 2024
Test Report
17 Apr 2024
Epoxy AdhesiveTest Report
26 Jul 2024
Test Report
26 Jul 2024
Test Report
26 Jul 2024
Test Report
26 Jul 2024
Header Assembly/FlangeTest Report
9 Dec 2022
Test Report
9 Dec 2022
Test Report
9 Dec 2022
Test Report
9 Dec 2022
Post-plating - Lead FreeTest Report
29 May 2024
Test Report
29 May 2024
Test Report
29 May 2024
Test Report
29 May 2024
Semiconductor Die 1Not AvailableNot AvailableNot AvailableNot Available
Semiconductor Die 2Test Report
28 May 2024
Test Report
28 May 2024
Test Report
28 May 2024
Test Report
28 May 2024
Semiconductor Die 3AU BUMPINGNot AvailableNot AvailableNot AvailableNot Available
DIENot AvailableNot AvailableNot AvailableNot Available
Semiconductor Die 4AU BUMPINGNot AvailableNot AvailableNot AvailableNot Available
DIENot AvailableNot AvailableNot AvailableNot Available
Semiconductor Die 5AU BUMPINGNot AvailableNot AvailableNot AvailableNot Available
DIENot AvailableNot AvailableNot AvailableNot Available
Semiconductor Die 6AU BUMPINGNot AvailableNot AvailableNot AvailableNot Available
DIENot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.