A5G26S008NT6

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of A5G26S008NT6Last Revision (GMT):
Tuesday, 24 September 2024, 01:37:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
A5G26S008NT6SOT2040HLSON661.286527 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 326 775282023-11-2433 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.49368899.9900000.805540
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000490.0100000.000081
Subtotal0.493737100.00000000.805621
Copper Lead-Frame, Pre-Plated AgCopper AlloyCopper and its compoundsCopper, metal7440-50-819.00875197.29100031.016198
Iron and its compoundsIron, metal7439-89-60.4630522.3700000.755552
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0033210.0170000.005420
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0324330.1660000.052921
Tin and its compoundsTin, metal7440-31-50.0058610.0300000.009564
Zinc and its compoundsZinc, metal7440-66-60.0246180.1260000.040169
Subtotal19.538036100.000000031.879823
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000200.0100000.000032
Silver and its compoundsSilver, metal7440-22-40.19733499.9900000.321986
Subtotal0.197354100.00000000.322018
Die EncapsulantDie EncapsulantEpoxy ResinsOther Epoxy resins0.9687002.5000001.580608
Inorganic Silicon compoundsSilica, vitreous60676-86-036.69435694.70000059.873447
Inorganic compoundsCarbon Black1333-86-40.1162440.3000000.189673
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.9687002.5000001.580608
Subtotal38.748000100.000000063.224336
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsProprietary Material-Other Epoxy resins0.0007353.0612000.001199
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.0007353.0612000.001199
Silver and its compoundsSilver, metal7440-22-40.02253193.8776000.036763
Subtotal0.024000100.00000000.039160
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0001490.0200000.000244
Tin and its compoundsTin, metal7440-31-50.74685199.9800001.218621
Subtotal0.747000100.00000001.218865
Semiconductor Die 1DieInorganic Silicon compoundsSilicon carbide409-21-20.39304195.2000000.641317
Inorganic compoundsGallium nitride25617-97-40.0152763.7000000.024925
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0045411.1000000.007410
Subtotal0.412858100.00000000.673652
Metallization LayerGold and its compoundsGold, metal7440-57-50.23832298.2884000.388865
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0002430.1001000.000396
Nickel and its compoundsNickel, metal7440-02-00.0014560.6005000.002376
Titanium and its compoundsTitanium, metal7440-32-60.0012380.5105000.002020
Tungsten and its compoundsTungsten, metal7440-33-70.0012140.5005000.001980
Subtotal0.242472100.00000000.395637
Semiconductor Die 2Semiconductor DieGold and its compoundsGold, metal7440-57-50.0090071.0200000.014697
Inorganic Silicon compoundsSilicon7440-21-30.85658197.0004001.397667
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0174811.9796000.028524
Subtotal0.883070100.00000001.440888
Total61.286527100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 A5G26S008NT6
Product content declaration of A5G26S008NT6
上次修订 Last Revision (GMT):
Tuesday, 24 September 2024, 01:37:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Die
OOOOOO

金属化层
Metallization Layer
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of A5G26S008NT6Last Revision (GMT):
Tuesday, 24 September 2024, 01:37:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
3 Jul 2024
Test Report
3 Jul 2024
Test Report
3 Jul 2024
Test Report
3 Jul 2024
Copper Lead-Frame, Pre-Plated AgAG PLATINGTest Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
CDA 194Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Die EncapsulantTest Report
7 Mar 2024
Test Report
7 Mar 2024
Test Report
7 Mar 2024
Test Report
7 Mar 2024
Epoxy AdhesiveTest Report
26 Jul 2024
Test Report
26 Jul 2024
Test Report
26 Jul 2024
Test Report
26 Jul 2024
Post-plating - Lead FreeTest Report
29 May 2024
Test Report
29 May 2024
Test Report
29 May 2024
Test Report
29 May 2024
Semiconductor Die 1Test Report
28 May 2024
Test Report
28 May 2024
Test Report
28 May 2024
Test Report
28 May 2024
Semiconductor Die 2AU BUMPINGNot AvailableNot AvailableNot AvailableNot Available
DIENot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.