AFSC5G26D37T2

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Product content declaration of AFSC5G26D37T2Last Revision (GMT):
Thursday, 07 March 2024, 01:03:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
AFSC5G26D37T2SOT1831HLLGA27120.345438 mg YesNoYesNickel/Gold (Ni/Au)Othere4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 457 365282024-01-11153 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.07670199.9900000.063734
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000080.0100000.000006
Subtotal0.076709100.00000000.063741
Capacitor 1CeramicBarium and its compoundsBarium oxide1304-28-50.26409260.0000000.219445
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.04401510.0000000.036574
Titanium and its compoundsTitanium dioxide1317-70-00.13204630.0000000.109723
Subtotal0.440154100.00000000.365742
Inner ElectrodeMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000020.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.01597099.9900000.013270
Subtotal0.015972100.00000000.013272
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.01399199.9900000.011625
Subtotal0.013992100.00000000.011627
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0030392.0000000.002525
Copper and its compoundsCopper, metal7440-50-80.13673990.0000000.113622
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0121558.0000000.010100
Subtotal0.151932100.00000000.126247
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000040.0100000.000003
Tin and its compoundsTin, metal7440-31-50.03794699.9900000.031531
Subtotal0.037950100.00000000.031534
Capacitor 2CeramicBarium and its compoundsBarium oxide1304-28-50.13204660.0000000.109723
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.02200810.0000000.018287
Titanium and its compoundsTitanium dioxide1317-70-00.06602330.0000000.054861
Subtotal0.220077100.00000000.182871
Inner ElectrodeMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.00798599.9900000.006635
Subtotal0.007986100.00000000.006636
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.00699599.9900000.005813
Subtotal0.006996100.00000000.005813
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0015192.0000000.001262
Copper and its compoundsCopper, metal7440-50-80.06836990.0000000.056811
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0060778.0000000.005050
Subtotal0.075966100.00000000.063123
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000020.0100000.000002
Tin and its compoundsTin, metal7440-31-50.01897399.9900000.015766
Subtotal0.018975100.00000000.015767
Capacitor 3CeramicBarium and its compoundsBarium oxide1304-28-50.13204660.0000000.109723
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.02200810.0000000.018287
Titanium and its compoundsTitanium dioxide1317-70-00.06602330.0000000.054861
Subtotal0.220077100.00000000.182871
Inner ElectrodeMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.00798599.9900000.006635
Subtotal0.007986100.00000000.006636
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.00699599.9900000.005813
Subtotal0.006996100.00000000.005813
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0015192.0000000.001262
Copper and its compoundsCopper, metal7440-50-80.06836990.0000000.056811
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0060778.0000000.005050
Subtotal0.075966100.00000000.063123
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000020.0100000.000002
Tin and its compoundsTin, metal7440-31-50.01897399.9900000.015766
Subtotal0.018975100.00000000.015767
Capacitor 4CeramicBarium and its compoundsBarium oxide1304-28-50.26409260.0000000.219445
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.04401510.0000000.036574
Titanium and its compoundsTitanium dioxide1317-70-00.13204630.0000000.109723
Subtotal0.440154100.00000000.365742
Inner ElectrodeMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000020.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.01597099.9900000.013270
Subtotal0.015972100.00000000.013272
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.01399199.9900000.011625
Subtotal0.013992100.00000000.011627
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0030392.0000000.002525
Copper and its compoundsCopper, metal7440-50-80.13673990.0000000.113622
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0121558.0000000.010100
Subtotal0.151932100.00000000.126247
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000040.0100000.000003
Tin and its compoundsTin, metal7440-31-50.03794699.9900000.031531
Subtotal0.037950100.00000000.031534
Capacitor 5CeramicBarium and its compoundsBarium oxide1304-28-50.13204660.0000000.109723
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.02200810.0000000.018287
Titanium and its compoundsTitanium dioxide1317-70-00.06602330.0000000.054861
Subtotal0.220077100.00000000.182871
Inner ElectrodeMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.00798599.9900000.006635
Subtotal0.007986100.00000000.006636
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.00699599.9900000.005813
Subtotal0.006996100.00000000.005813
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0015192.0000000.001262
Copper and its compoundsCopper, metal7440-50-80.06836990.0000000.056811
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0060778.0000000.005050
Subtotal0.075966100.00000000.063123
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000020.0100000.000002
Tin and its compoundsTin, metal7440-31-50.01897399.9900000.015766
Subtotal0.018975100.00000000.015767
Capacitor 6CeramicCalcium and its compoundsCalcium monoxide1305-78-80.01200425.0000000.009974
Manganese and its compoundsManganese oxide1344-43-00.0024015.0000000.001995
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.00480210.0000000.003990
Zirconium and its compoundsZirconium oxide1314-23-40.02880960.0000000.023939
Subtotal0.048015100.00000000.039898
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00199699.9000000.001659
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.1000000.000002
Subtotal0.001998100.00000000.001660
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000030.1000000.000003
Nickel and its compoundsNickel, metal7440-02-00.00299499.9000000.002488
Subtotal0.002997100.00000000.002490
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0006002.0000000.000499
Copper and its compoundsCopper, metal7440-50-80.02699790.0000000.022433
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0024008.0000000.001994
Subtotal0.029997100.00000000.024926
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000070.1000000.000006
Tin and its compoundsTin, metal7440-31-50.00698699.9000000.005805
Subtotal0.006993100.00000000.005811
Capacitor 7CeramicBarium and its compoundsBarium oxide1304-28-50.13204660.0000000.109723
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.02200810.0000000.018287
Titanium and its compoundsTitanium dioxide1317-70-00.06602330.0000000.054861
Subtotal0.220077100.00000000.182871
Inner ElectrodeMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.00798599.9900000.006635
Subtotal0.007986100.00000000.006636
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.00699599.9900000.005813
Subtotal0.006996100.00000000.005813
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0015192.0000000.001262
Copper and its compoundsCopper, metal7440-50-80.06836990.0000000.056811
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0060778.0000000.005050
Subtotal0.075966100.00000000.063123
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000020.0100000.000002
Tin and its compoundsTin, metal7440-31-50.01897399.9900000.015766
Subtotal0.018975100.00000000.015767
Capacitor 8CeramicBarium and its compoundsBarium oxide1304-28-50.26409260.0000000.219445
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.04401510.0000000.036574
Titanium and its compoundsTitanium dioxide1317-70-00.13204630.0000000.109723
Subtotal0.440154100.00000000.365742
Inner ElectrodeMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000020.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.01597099.9900000.013270
Subtotal0.015972100.00000000.013272
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.01399199.9900000.011625
Subtotal0.013992100.00000000.011627
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0030392.0000000.002525
Copper and its compoundsCopper, metal7440-50-80.13673990.0000000.113622
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0121558.0000000.010100
Subtotal0.151932100.00000000.126247
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000040.0100000.000003
Tin and its compoundsTin, metal7440-31-50.03794699.9900000.031531
Subtotal0.037950100.00000000.031534
Capacitor 9CeramicBarium and its compoundsBarium oxide1304-28-50.26409260.0000000.219445
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.04401510.0000000.036574
Titanium and its compoundsTitanium dioxide1317-70-00.13204630.0000000.109723
Subtotal0.440154100.00000000.365742
Inner ElectrodeMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000020.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.01597099.9900000.013270
Subtotal0.015972100.00000000.013272
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.01399199.9900000.011625
Subtotal0.013992100.00000000.011627
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0030392.0000000.002525
Copper and its compoundsCopper, metal7440-50-80.13673990.0000000.113622
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0121558.0000000.010100
Subtotal0.151932100.00000000.126247
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000040.0100000.000003
Tin and its compoundsTin, metal7440-31-50.03794699.9900000.031531
Subtotal0.037950100.00000000.031534
Capacitor 10CeramicCalcium and its compoundsCalcium monoxide1305-78-80.01200425.0000000.009974
Manganese and its compoundsManganese oxide1344-43-00.0024015.0000000.001995
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.00480210.0000000.003990
Zirconium and its compoundsZirconium oxide1314-23-40.02880960.0000000.023939
Subtotal0.048015100.00000000.039898
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00199699.9000000.001659
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.1000000.000002
Subtotal0.001998100.00000000.001660
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000030.1000000.000003
Nickel and its compoundsNickel, metal7440-02-00.00299499.9000000.002488
Subtotal0.002997100.00000000.002490
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0006002.0000000.000499
Copper and its compoundsCopper, metal7440-50-80.02699790.0000000.022433
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0024008.0000000.001994
Subtotal0.029997100.00000000.024926
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000070.1000000.000006
Tin and its compoundsTin, metal7440-31-50.00698699.9000000.005805
Subtotal0.006993100.00000000.005811
Capacitor 11CeramicBarium and its compoundsBarium oxide1304-28-50.13204660.0000000.109723
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.02200810.0000000.018287
Titanium and its compoundsTitanium dioxide1317-70-00.06602330.0000000.054861
Subtotal0.220077100.00000000.182871
Inner ElectrodeMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.00798599.9900000.006635
Subtotal0.007986100.00000000.006636
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.00699599.9900000.005813
Subtotal0.006996100.00000000.005813
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0015192.0000000.001262
Copper and its compoundsCopper, metal7440-50-80.06836990.0000000.056811
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0060778.0000000.005050
Subtotal0.075966100.00000000.063123
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000020.0100000.000002
Tin and its compoundsTin, metal7440-31-50.01897399.9900000.015766
Subtotal0.018975100.00000000.015767
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins2.8553005.0000002.372587
Inorganic Silicon compoundsSilica, vitreous60676-86-049.68222087.00000041.283011
Inorganic Silicon compoundsSilicon dioxide7631-86-91.7131803.0000001.423552
Inorganic compoundsCarbon Black1333-86-40.2855300.5000000.237259
Magnesium and its compoundsProprietary Material-Other magnesium compounds0.0571060.1000000.047452
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.7423781.3000000.616873
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins1.7131803.0000001.423552
Zinc and its compoundsProprietary Material-Other zinc compounds0.0571060.1000000.047452
Subtotal57.106000100.000000047.451736
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsProprietary Material-Other Epoxy resins0.0998263.0612000.082949
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.0998263.0612000.082949
Silver and its compoundsSilver, metal7440-22-43.06134993.8776002.543801
Subtotal3.261000100.00000002.709700
Inductor 1Inner ElectrodeMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000001
Silver and its compoundsSilver, metal7440-22-40.00895999.9900000.007444
Subtotal0.008960100.00000000.007445
InsulationAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.03980840.0000000.033078
Boron and its compoundsBoron oxide1303-86-20.00995210.0000000.008270
Inorganic Silicon compoundsSilicon dioxide7631-86-90.04976050.0000000.041348
Subtotal0.099520100.00000000.082695
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.00767999.9900000.006381
Subtotal0.007680100.00000000.006382
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0002881.0000000.000239
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0025929.0000000.002154
Silver and its compoundsSilver, metal7440-22-40.02592090.0000000.021538
Subtotal0.028800100.00000000.023931
Protective CoatingAluminum and its compoundsAluminum oxide1302-74-50.0002565.0000000.000213
Boron and its compoundsBoron oxide1303-86-20.00076815.0000000.000638
Cobalt and its compoundsCobalt oxide1307-96-60.0002565.0000000.000213
Inorganic Silicon compoundsSilicon dioxide7631-86-90.00358470.0000000.002978
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0002565.0000000.000213
Subtotal0.005120100.00000000.004254
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000001
Tin and its compoundsTin, metal7440-31-50.00991999.9900000.008242
Subtotal0.009920100.00000000.008243
Inductor 2InductorAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.08680024.8000000.072126
Boron and its compoundsBoron oxide1303-86-20.0238006.8000000.019776
Cobalt and its compoundsC.I. Pigment Blue 281345-16-00.0014000.4000000.001163
Inorganic Silicon compoundsSilicon dioxide7631-86-90.12320035.2000000.102372
Nickel and its compoundsNickel, metal7440-02-00.0168004.8000000.013960
Silver and its compoundsSilver, metal7440-22-40.07630021.8000000.063401
Tin and its compoundsTin, metal7440-31-50.0217006.2000000.018031
Subtotal0.350000100.00000000.290829
Inductor 3InductorAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.08680024.8000000.072126
Boron and its compoundsBoron oxide1303-86-20.0238006.8000000.019776
Cobalt and its compoundsC.I. Pigment Blue 281345-16-00.0014000.4000000.001163
Inorganic Silicon compoundsSilicon dioxide7631-86-90.12320035.2000000.102372
Nickel and its compoundsNickel, metal7440-02-00.0168004.8000000.013960
Silver and its compoundsSilver, metal7440-22-40.07630021.8000000.063401
Tin and its compoundsTin, metal7440-31-50.0217006.2000000.018031
Subtotal0.350000100.00000000.290829
Inductor 4InductorAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.08680024.8000000.072126
Boron and its compoundsBoron oxide1303-86-20.0238006.8000000.019776
Cobalt and its compoundsC.I. Pigment Blue 281345-16-00.0014000.4000000.001163
Inorganic Silicon compoundsSilicon dioxide7631-86-90.12320035.2000000.102372
Nickel and its compoundsNickel, metal7440-02-00.0168004.8000000.013960
Silver and its compoundsSilver, metal7440-22-40.07630021.8000000.063401
Tin and its compoundsTin, metal7440-31-50.0217006.2000000.018031
Subtotal0.350000100.00000000.290829
ResistorCeramicAluminum and its compoundsAluminum oxide1302-74-50.02315496.1000000.019239
Calcium and its compoundsCalcium monoxide1305-78-80.0000960.4000000.000080
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0003611.5000000.000300
Magnesium and its compoundsMagnesium-oxide1309-48-40.0004822.0000000.000400
Subtotal0.024093100.00000000.020020
ConductorBismuth and its compoundsBismuth trioxide1304-76-30.00013813.8000000.000115
Boron and its compoundsBoron oxide1303-86-20.0000121.2000000.000010
Inorganic Silicon compoundsQuartz14808-60-70.0000464.6000000.000038
Silver and its compoundsSilver, metal7440-22-40.00080480.4000000.000668
Subtotal0.001000100.00000000.000831
ElectrodeBismuth and its compoundsBismuth trioxide1304-76-30.0000454.5000000.000037
Boron and its compoundsBoron oxide1303-86-20.0000020.2000000.000002
Inorganic Silicon compoundsQuartz14808-60-70.0000272.7000000.000022
Palladium and its compoundsPalladium, metal7440-05-30.0000373.7000000.000031
Silver and its compoundsSilver, metal7440-22-40.00088988.9000000.000739
Subtotal0.001000100.00000000.000831
InsulationInorganic Silicon compoundsSilica, vitreous60676-86-00.00016616.6000000.000138
Inorganic compoundsProprietary Material - Other inorganic compounds0.0000434.3000000.000036
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.00025025.0000000.000208
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.00054154.1000000.000449
Subtotal0.001000100.00000000.000831
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00172999.9900000.001437
Subtotal0.001730100.00000000.001437
Protective CoatingAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.0000676.7000000.000056
Bismuth and its compoundsBismuth trioxide1304-76-30.00075575.5000000.000627
Boron and its compoundsBoron oxide1303-86-20.0000101.0000000.000008
Inorganic Silicon compoundsQuartz14808-60-70.00016816.8000000.000140
Subtotal0.001000100.00000000.000831
Resistive LayerAluminum and its compoundsAluminum oxide1302-74-50.0000725.5100000.000060
Boron and its compoundsBoron oxide1303-86-20.0000120.9000000.000010
Copper and its compoundsCupric oxide1317-38-00.0000120.9000000.000010
Inorganic Silicon compoundsSilicon dioxide7631-86-90.00025719.5400000.000213
Lead and its compoundsLead monooxide1317-36-80.0000745.6500000.000062
Manganese and its compoundsManganese tetraoxide1317-35-70.0000241.8000000.000020
Palladium and its compoundsPalladium, metal7440-05-30.0001189.0200000.000098
Ruthenium and its compoundsRuthenium oxide12036-10-10.0001189.0200000.000098
Silver and its compoundsSilver, metal7440-22-40.00056543.0500000.000470
Tantalum and its compoundsTantalum (V) oxide1314-61-00.0000372.8100000.000031
Zinc and its compoundsZinc oxide1314-13-20.0000241.8000000.000020
Subtotal0.001313100.00000000.001091
TerminationChromium and Chromium III compoundsChromium, metal7440-47-30.00035035.0000000.000291
Nickel and its compoundsNickel, metal7440-02-00.00065065.0000000.000540
Subtotal0.001000100.00000000.000831
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Tin and its compoundsTin, metal7440-31-50.00259399.9900000.002155
Subtotal0.002594100.00000000.002156
Semiconductor Die 1Semiconductor DieGold and its compoundsGold, metal7440-57-50.0550801.0200000.045768
Inorganic Silicon compoundsSilicon, doped5.23802297.0004004.352489
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1068981.9796000.088826
Subtotal5.400000100.00000004.487083
Semiconductor Die 2Semiconductor DieArsenic and its compoundsGallium arsenide1303-00-05.97800098.0000004.967367
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1220002.0000000.101375
Subtotal6.100000100.00000005.068742
Solder PasteSolder PasteCopper and its compoundsCopper, metal7440-50-80.0264892.9864000.022011
Glycol Ethers and Acetates - Specific2-(2-butoxyethoxy)ethanol112-34-50.0241092.7181000.020034
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.11043912.4509000.091769
Silver and its compoundsSilver, metal7440-22-40.0381884.3053000.031732
Tin and its compoundsTin, metal7440-31-50.68777477.5393000.571500
Subtotal0.887000100.00000000.737045
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuBarium and its compoundsBarium sulfate7727-43-70.7623901.8239000.633502
Copper and its compoundsCopper, metal7440-50-822.59126954.04610018.772020
Epoxy ResinsOther Epoxy resins2.4620205.8900002.045794
Gold and its compoundsGold, metal7440-57-50.4241451.0147000.352439
Inorganic Silicon compoundsFibrous-glass-wool65997-17-35.29476412.6669004.399638
Inorganic Silicon compoundsSilica, vitreous60676-86-06.35372515.2003005.279573
Nickel and its compoundsNickel, metal7440-02-03.9116869.3581003.250381
Subtotal41.799999100.000000034.733347
Total120.345438100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 AFSC5G26D37T2
Product content declaration of AFSC5G26D37T2
上次修订 Last Revision (GMT):
Thursday, 07 March 2024, 01:03:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
电容器
Capacitor 1
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 2
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 3
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 4
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 5
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 6
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 7
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 8
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 9
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 10
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 11
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
电感
Inductor 1
内电极
Inner Electrode
OOOOOO

绝缘
Insulation
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

防护涂料
Protective Coating
OOOOOO

镀锡
Tin Plating
OOOOOO
电感
Inductor 2
电感
Inductor
OOOOOO
电感
Inductor 3
电感
Inductor
OOOOOO
电感
Inductor 4
电感
Inductor
OOOOOO
电阻
Resistor
陶瓷的
Ceramic
OOOOOO

导体
Conductor
OOOOOO

电极
Electrode
XOOOOO

绝缘
Insulation
OOOOOO

镀镍层
Nickel Plating
OOOOOO

防护涂料
Protective Coating
OOOOOO

电阻层
Resistive Layer
XOOOOO

终端材料
Termination
OOOOOO

镀锡
Tin Plating
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
焊锡膏
Solder Paste
焊锡膏
Solder Paste
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of AFSC5G26D37T2Last Revision (GMT):
Thursday, 07 March 2024, 01:03:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Test Report
13 Jul 2023
Capacitor 1CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
20 May 2022
Test Report
20 May 2022
Capacitor 2CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Capacitor 3CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Capacitor 4CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Capacitor 5CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Capacitor 6CERAMICTest Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
INNER ELECTRODETest Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Capacitor 7CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Capacitor 8CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Capacitor 9CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Capacitor 10CERAMICTest Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
12 Dec 2022
INNER ELECTRODETest Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
Test Report
6 Oct 2022
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Capacitor 11CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Test Report
4 Jun 2021
Die EncapsulantTest Report
30 Jan 2024
Test Report
30 Jan 2024
Test Report
30 Jan 2024
Test Report
30 Jan 2024
Epoxy AdhesiveTest Report
14 Apr 2023
Test Report
14 Apr 2023
Test Report
14 Apr 2023
Test Report
14 Apr 2023
Inductor 1ELECTRODETest Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
GLAZE (BB)Not AvailableNot AvailableTest Report
28 Oct 2020
Test Report
28 Oct 2020
GLAZE (BC)Not AvailableNot AvailableTest Report
27 Nov 2020
Test Report
27 Nov 2020
GLAZE BBTest Report
14 Sep 2022
Test Report
14 Sep 2022
Not AvailableNot Available
GLAZE BCTest Report
1 Nov 2022
Test Report
1 Nov 2022
Not AvailableNot Available
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Not Available
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Not AvailableNot Available
Inductor 2ELECTRODETest Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
GLAZE (BB)Not AvailableNot AvailableTest Report
28 Oct 2020
Test Report
28 Oct 2020
GLAZE (BC)Not AvailableNot AvailableTest Report
27 Nov 2020
Test Report
27 Nov 2020
GLAZE BBTest Report
14 Sep 2022
Test Report
14 Sep 2022
Not AvailableNot Available
GLAZE BCTest Report
1 Nov 2022
Test Report
1 Nov 2022
Not AvailableNot Available
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Not Available
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Not Available
Inductor 3ELECTRODETest Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
GLAZE (BB)Not AvailableNot AvailableTest Report
28 Oct 2020
Test Report
28 Oct 2020
GLAZE (BC)Not AvailableNot AvailableTest Report
27 Nov 2020
Test Report
27 Nov 2020
INNER GLAZETest Report
14 Sep 2022
Test Report
14 Sep 2022
Not AvailableNot Available
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Not Available
OUTER GLAZETest Report
1 Nov 2022
Test Report
1 Nov 2022
Not AvailableNot Available
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Not Available
Inductor 4ELECTRODETest Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
GLAZE (BB)Not AvailableNot AvailableTest Report
28 Oct 2020
Test Report
28 Oct 2020
GLAZE (BC)Not AvailableNot AvailableTest Report
27 Nov 2020
Test Report
27 Nov 2020
INNER GLAZETest Report
14 Sep 2022
Test Report
14 Sep 2022
Not AvailableNot Available
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Not Available
OUTER GLAZETest Report
1 Nov 2022
Test Report
1 Nov 2022
Not AvailableNot Available
SN PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Not Available
ResistorALUMINATest Report
6 Nov 2019
Test Report
6 Nov 2019
Test Report
6 Nov 2019
Test Report
6 Nov 2019
BOTTOM CONDUCTORTest Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
INSULATION - 1ST OVERCOATTest Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
INSULATION - 2ND OVERCOATTest Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
NI PLATINGTest Report
22 Jul 2020
Test Report
22 Jul 2020
Test Report
22 Jul 2020
Test Report
22 Jul 2020
RESISTIVE LAYERTest Report
6 Nov 2020
Test Report
6 Nov 2020
Test Report
6 Nov 2020
Test Report
6 Nov 2020
SN PLATINGTest Report
22 Jul 2020
Test Report
22 Jul 2020
Test Report
22 Jul 2020
Test Report
22 Jul 2020
TERMINAL CONDUCTORTest Report
6 Nov 2019
Test Report
6 Nov 2019
Test Report
6 Nov 2019
Test Report
6 Nov 2019
TOP CONDUCTORTest Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Semiconductor Die 1Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Semiconductor Die 2Test Report
2 May 2023
Test Report
2 May 2023
Test Report
2 May 2023
Test Report
2 May 2023
Solder PasteTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
15 Feb 2020
Test Report
12 Oct 2023
Substrate, Pre-plated NiAuAUS SR1Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
COPPERTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
E705GTest Report
16 Mar 2023
Test Report
16 Mar 2023
Test Report
16 Mar 2023
Test Report
16 Mar 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.