AFSC5G26F38T2

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of AFSC5G26F38T2Last Revision (GMT):
Friday, 07 June 2024, 12:40:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
AFSC5G26F38T2SOT1831HLLGA27151.784208 mg YesNoYesNickel/Palladium/Gold (Ni/Pd/Au)Othere4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 011 295282024-07-097Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.57504099.9900000.378854
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000580.0100000.000038
Subtotal0.575098100.00000000.378892
Capacitor 1CeramicCalcium and its compoundsCalcium monoxide1305-78-80.02400825.0000000.015817
Manganese and its compoundsManganese oxide1344-43-00.0048025.0000000.003163
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.00960310.0000000.006327
Zirconium and its compoundsZirconium oxide1314-23-40.05761860.0000000.037961
Subtotal0.096030100.00000000.063268
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00399299.9000000.002630
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000040.1000000.000003
Subtotal0.003996100.00000000.002633
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000060.1000000.000004
Nickel and its compoundsNickel, metal7440-02-00.00598899.9000000.003945
Subtotal0.005994100.00000000.003949
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0012002.0000000.000790
Copper and its compoundsCopper, metal7440-50-80.05399590.0000000.035573
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0047998.0000000.003162
Subtotal0.059994100.00000000.039526
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000140.1000000.000009
Tin and its compoundsTin, metal7440-31-50.01397299.9000000.009205
Subtotal0.013986100.00000000.009214
Capacitor 2CeramicCalcium and its compoundsCalcium monoxide1305-78-80.02400825.0000000.015817
Manganese and its compoundsManganese oxide1344-43-00.0048025.0000000.003163
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.00960310.0000000.006327
Zirconium and its compoundsZirconium oxide1314-23-40.05761860.0000000.037961
Subtotal0.096030100.00000000.063268
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00399299.9000000.002630
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000040.1000000.000003
Subtotal0.003996100.00000000.002633
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000060.1000000.000004
Nickel and its compoundsNickel, metal7440-02-00.00598899.9000000.003945
Subtotal0.005994100.00000000.003949
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0012002.0000000.000790
Copper and its compoundsCopper, metal7440-50-80.05399590.0000000.035573
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0047998.0000000.003162
Subtotal0.059994100.00000000.039526
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000140.1000000.000009
Tin and its compoundsTin, metal7440-31-50.01397299.9000000.009205
Subtotal0.013986100.00000000.009214
Capacitor 3CeramicCalcium and its compoundsCalcium monoxide1305-78-80.02400825.0000000.015817
Manganese and its compoundsManganese oxide1344-43-00.0048025.0000000.003163
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.00960310.0000000.006327
Zirconium and its compoundsZirconium oxide1314-23-40.05761860.0000000.037961
Subtotal0.096030100.00000000.063268
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00399299.9000000.002630
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000040.1000000.000003
Subtotal0.003996100.00000000.002633
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000060.1000000.000004
Nickel and its compoundsNickel, metal7440-02-00.00598899.9000000.003945
Subtotal0.005994100.00000000.003949
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.05399590.0000000.035573
Copper and its compoundsCopper, metal7440-50-80.0012002.0000000.000790
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0047998.0000000.003162
Subtotal0.059994100.00000000.039526
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000140.1000000.000009
Tin and its compoundsTin, metal7440-31-50.01397299.9000000.009205
Subtotal0.013986100.00000000.009214
Capacitor 4CeramicBarium and its compoundsBarium oxide1304-28-50.13200060.0000000.086966
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.02200010.0000000.014494
Titanium and its compoundsTitanium (IV) Oxide13463-67-70.06600030.0000000.043483
Subtotal0.220000100.00000000.144943
Inner ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00799999.9900000.005270
Subtotal0.008000100.00000000.005271
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00699999.9900000.004611
Subtotal0.007000100.00000000.004612
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0015202.0000000.001001
Copper and its compoundsCopper, metal7440-50-80.06840090.0000000.045064
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0060808.0000000.004006
Subtotal0.076000100.00000000.050071
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000001
Tin and its compoundsTin, metal7440-31-50.01899899.9900000.012516
Subtotal0.019000100.00000000.012518
Capacitor 5CeramicCalcium and its compoundsCalcium monoxide1305-78-80.05350025.0000000.035247
Manganese and its compoundsManganese oxide1344-43-00.0107005.0000000.007050
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.02140010.0000000.014099
Zirconium and its compoundsZirconium oxide1314-23-40.12840060.0000000.084594
Subtotal0.214000100.00000000.140990
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00899999.9900000.005929
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Subtotal0.009000100.00000000.005929
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00699999.9900000.004611
Subtotal0.007000100.00000000.004612
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0016002.0000000.001054
Copper and its compoundsCopper, metal7440-50-80.07200090.0000000.047436
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0064008.0000000.004216
Subtotal0.080000100.00000000.052706
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000001
Tin and its compoundsTin, metal7440-31-50.01999899.9900000.013175
Subtotal0.020000100.00000000.013177
Capacitor 6CeramicCalcium and its compoundsCalcium monoxide1305-78-80.05350025.0000000.035247
Manganese and its compoundsManganese oxide1344-43-00.0107005.0000000.007050
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.02140010.0000000.014099
Zirconium and its compoundsZirconium oxide1314-23-40.12840060.0000000.084594
Subtotal0.214000100.00000000.140990
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00899999.9900000.005929
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Subtotal0.009000100.00000000.005929
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00699999.9900000.004611
Subtotal0.007000100.00000000.004612
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0016002.0000000.001054
Copper and its compoundsCopper, metal7440-50-80.07200090.0000000.047436
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0064008.0000000.004216
Subtotal0.080000100.00000000.052706
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000001
Tin and its compoundsTin, metal7440-31-50.01999899.9900000.013175
Subtotal0.020000100.00000000.013177
Capacitor 7CeramicCalcium and its compoundsCalcium monoxide1305-78-80.05350025.0000000.035247
Manganese and its compoundsManganese oxide1344-43-00.0107005.0000000.007050
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.02140010.0000000.014099
Zirconium and its compoundsZirconium oxide1314-23-40.12840060.0000000.084594
Subtotal0.214000100.00000000.140990
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00899999.9900000.005929
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Subtotal0.009000100.00000000.005929
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00699999.9900000.004611
Subtotal0.007000100.00000000.004612
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0016002.0000000.001054
Copper and its compoundsCopper, metal7440-50-80.07200090.0000000.047436
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0064008.0000000.004216
Subtotal0.080000100.00000000.052706
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000001
Tin and its compoundsTin, metal7440-31-50.01999899.9900000.013175
Subtotal0.020000100.00000000.013177
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins4.8911005.0000003.222404
Inorganic Silicon compoundsSilica, vitreous60676-86-085.10514087.00000056.069825
Inorganic Silicon compoundsSilicon dioxide7631-86-92.9346603.0000001.933442
Inorganic compoundsCarbon Black1333-86-40.4891100.5000000.322240
Magnesium and its compoundsProprietary Material-Other magnesium compounds0.0978220.1000000.064448
Miscellaneous substancesProprietary Material-Other miscellaneous substances.1.2716861.3000000.837825
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins2.9346603.0000001.933442
Zinc and its compoundsProprietary Material-Other zinc compounds0.0978220.1000000.064448
Subtotal97.822000100.000000064.448075
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsProprietary Material-Other Epoxy resins0.0287453.0612000.018938
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.0287453.0612000.018938
Silver and its compoundsSilver, metal7440-22-40.88151193.8776000.580766
Subtotal0.939000100.00000000.618641
Inductor 1CeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.09545640.0000000.062889
Boron and its compoundsBoron oxide1303-86-20.02386410.0000000.015722
Inorganic Silicon compoundsSilicon dioxide7631-86-90.11932050.0000000.078612
Subtotal0.238641100.00000000.157224
Inner ElectrodeMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000480.1000000.000031
Silver and its compoundsSilver, metal7440-22-40.04767899.9000000.031412
Subtotal0.047726100.00000000.031443
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000060.1000000.000004
Nickel and its compoundsNickel, metal7440-02-00.00635799.9000000.004188
Subtotal0.006363100.00000000.004192
Outer ElectrodeMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000320.1000000.000021
Silver and its compoundsSilver, metal7440-22-40.03178799.9000000.020942
Subtotal0.031818100.00000000.020963
Protective CoatingAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.0007955.0000000.000524
Boron and its compoundsBoron oxide1303-86-20.00238615.0000000.001572
Cobalt and its compoundsCobalt oxide1307-96-60.0007955.0000000.000524
Inorganic Silicon compoundsSilicon dioxide7631-86-90.01113570.0000000.007336
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0007955.0000000.000524
Subtotal0.015908100.00000000.010480
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000100.1000000.000006
Tin and its compoundsTin, metal7440-31-50.00953599.9000000.006282
Subtotal0.009544100.00000000.006288
Inductor 2CeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.04117640.0000000.027128
Boron and its compoundsBoron oxide1303-86-20.01029410.0000000.006782
Inorganic Silicon compoundsQuartz14808-60-70.05147050.0000000.033910
Subtotal0.102940100.00000000.067820
Inner ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000001
Silver and its compoundsSilver, metal7440-22-40.02058799.9900000.013563
Subtotal0.020589100.00000000.013565
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00679299.9900000.004475
Subtotal0.006794100.00000000.004476
Outer ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000030.0100000.000002
Silver and its compoundsSilver, metal7440-22-40.02779199.9900000.018309
Subtotal0.027793100.00000000.018311
Protective CoatingAluminum and its compoundsAluminum oxide1302-74-50.0003915.0000000.000258
Boron and its compoundsBoron oxide1303-86-20.00117415.0000000.000773
Cobalt and its compoundsCobalt oxide1307-96-60.0003915.0000000.000258
Inorganic Silicon compoundsSilicon dioxide7631-86-90.00547870.0000000.003609
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0003915.0000000.000258
Subtotal0.007826100.00000000.005156
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Tin and its compoundsTin, metal7440-31-50.00905799.9900000.005967
Subtotal0.009058100.00000000.005968
Inductor 3CeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.04117640.0000000.027128
Boron and its compoundsBoron oxide1303-86-20.01029410.0000000.006782
Inorganic Silicon compoundsQuartz14808-60-70.05147050.0000000.033910
Subtotal0.102940100.00000000.067820
Inner ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000001
Silver and its compoundsSilver, metal7440-22-40.02058799.9900000.013563
Subtotal0.020589100.00000000.013565
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00679299.9900000.004475
Subtotal0.006794100.00000000.004476
Outer ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000030.0100000.000002
Silver and its compoundsSilver, metal7440-22-40.02779199.9900000.018309
Subtotal0.027793100.00000000.018311
Protective CoatingAluminum and its compoundsAluminum oxide1302-74-50.0003915.0000000.000258
Boron and its compoundsBoron oxide1303-86-20.00117415.0000000.000773
Cobalt and its compoundsCobalt oxide1307-96-60.0003915.0000000.000258
Inorganic Silicon compoundsSilicon dioxide7631-86-90.00547870.0000000.003609
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0003915.0000000.000258
Subtotal0.007826100.00000000.005156
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Tin and its compoundsTin, metal7440-31-50.00905799.9900000.005967
Subtotal0.009058100.00000000.005968
Inductor 4Inner ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000040.0100000.000003
Silver and its compoundsSilver, metal7440-22-40.04117399.9900000.027126
Subtotal0.041177100.00000000.027129
InsulationAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.08235440.0000000.054257
Boron and its compoundsBoron oxide1303-86-20.02058810.0000000.013564
Inorganic Silicon compoundsSilicon dioxide7631-86-90.10294250.0000000.067821
Subtotal0.205884100.00000000.135643
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.01358699.9900000.008951
Subtotal0.013587100.00000000.008951
Outer ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000060.0100000.000004
Silver and its compoundsSilver, metal7440-22-40.05558199.9900000.036619
Subtotal0.055587100.00000000.036622
Protective CoatingAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.0007825.0000000.000516
Boron and its compoundsBoron oxide1303-86-20.00234715.0000000.001546
Cobalt and its compoundsCobalt oxide1307-96-60.0007825.0000000.000516
Inorganic Silicon compoundsSilicon dioxide7631-86-90.01095470.0000000.007217
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0007825.0000000.000516
Subtotal0.015648100.00000000.010310
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000001
Tin and its compoundsTin, metal7440-31-50.01811499.9900000.011934
Subtotal0.018116100.00000000.011935
ResistorAlumina SubstrateAluminum and its compoundsAluminum oxide1302-74-50.02739396.0000000.018047
Inorganic Silicon compoundsQuartz14808-60-70.0007132.5000000.000470
Magnesium and its compoundsMagnesium-oxide1309-48-40.0004281.5000000.000282
Subtotal0.028534100.00000000.018799
Bottom ConductorBismuth and its compoundsBismuth trioxide1304-76-30.0000232.3500000.000016
Inorganic Silicon compoundsFibrous-glass-wool65997-17-30.0000717.0500000.000046
Palladium and its compoundsPalladium, metal7440-05-30.0000060.6000000.000004
PolymersEthyl cellulose9004-57-30.0000777.6500000.000050
Silver and its compoundsSilver, metal7440-22-40.00082482.3500000.000543
Subtotal0.001000100.00000000.000659
GlazeLead and its compoundsFrits, chemicals65997-18-40.00099999.9000000.000658
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.1000000.000001
Subtotal0.001000100.00000000.000659
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000020.1000000.000001
Nickel and its compoundsNickel, metal7440-02-00.00165899.9000000.001092
Subtotal0.001659100.00000000.001093
Protective CoatingInorganic Silicon compoundsSilicon dioxide7631-86-90.00042042.0142000.000277
Inorganic compoundsCarbon Black1333-86-40.0000505.0305000.000033
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.00010910.9411000.000072
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.00042042.0142000.000277
Subtotal0.001000100.00000000.000659
Resistive LayerInorganic Silicon compoundsSilicon dioxide7631-86-90.00038038.0000000.000250
Lead and its compoundsFrits, chemicals65997-18-40.00012012.0000000.000079
Ruthenium and its compoundsRuthenium oxide12036-10-10.00050050.0000000.000329
Subtotal0.001000100.00000000.000659
SputterChromium and Chromium III compoundsChromium, metal7440-47-30.00020020.0000000.000132
Tin and its compoundsTin, metal7440-31-50.00080080.0000000.000527
Subtotal0.001000100.00000000.000659
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.1000000.000001
Tin and its compoundsTin, metal7440-31-50.00109599.9000000.000722
Subtotal0.001096100.00000000.000722
Top ConductorMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.1000000.000001
Silver and its compoundsSilver, metal7440-22-40.00099999.9000000.000658
Subtotal0.001000100.00000000.000659
Semiconductor Die 1Semiconductor DieGold and its compoundsGold, metal7440-57-50.0182051.0200000.011994
Inorganic Silicon compoundsSilicon, doped1.73128397.0004001.140621
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0353321.9796000.023278
Subtotal1.784820100.00000001.175893
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon7440-21-31.64684889.6000001.084993
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0165420.9000000.010898
Nickel and its compoundsNickel, metal7440-02-00.0091900.5000000.006055
Silver and its compoundsSilver, metal7440-22-40.0057900.3150000.003814
Tin and its compoundsTin, metal7440-31-50.1596308.6850000.105169
Subtotal1.838000100.00000001.210930
Solder FluxSolder FluxCopper and its compoundsCopper, metal7440-50-80.0152012.9864000.010015
Glycol Ethers and Acetates - Specific2-(2-butoxyethoxy)ethanol112-34-50.0138352.7181000.009115
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.06337512.4509000.041753
Silver and its compoundsSilver, metal7440-22-40.0219144.3053000.014438
Tin and its compoundsTin, metal7440-31-50.39467577.5393000.260024
Subtotal0.509000100.00000000.335344
Solder PasteSolder PasteCopper and its compoundsCopper, metal7440-50-80.0078450.5000000.005169
Silver and its compoundsSilver, metal7440-22-40.0470703.0000000.031011
Tin and its compoundsTin, metal7440-31-51.51408596.5000000.997525
Subtotal1.569000100.00000001.033704
Substrate, Pre-plated NiPdAuSubstrate, Pre-plated NiPdAuAcrylatesProprietary Material-Other acrylates0.8159941.8630000.537601
Aliphatic AminesProprietary Material-Other aliphatic amines0.0600060.1370000.039534
Azo compoundsOther azo-dyes (other than those that can release carcinogenic amines)0.0118260.0270000.007791
Barium and its compoundsBarium sulfate7727-43-70.3600360.8220000.237203
Cyanide compoundsPhthalocyanine Blue57455-37-50.0118260.0270000.007791
Epoxy ResinsOther Epoxy resins0.3600360.8220000.237203
Gold and its compoundsGold, metal7440-57-50.0109500.0250000.007214
Inorganic Silicon compoundsFibrous-glass-wool65997-17-312.23334027.9300008.059692
Inorganic Silicon compoundsSilica, vitreous60676-86-00.3600360.8220000.237203
Inorganic Silicon compoundsSilicon dioxide7631-86-916.83058838.42600011.088497
Magnesium and its compoundsTalc14807-96-60.0600060.1370000.039534
Miscellaneous substancesProprietary Material-Other miscellaneous substances.3.2569687.4360002.145788
Nickel and its compoundsNickel, metal7440-02-00.6000601.3700000.395338
Palladium and its compoundsPalladium, metal7440-05-30.0109500.0250000.007214
PolymersAcrylic acid ester copolymer78506-70-40.1800180.4110000.118601
PolymersBT Resin (CAS# 13676-54-5/25722-66-1)8.63736019.7200005.690552
Subtotal43.800000100.000000028.856757
Total151.784208100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 AFSC5G26F38T2
Product content declaration of AFSC5G26F38T2
上次修订 Last Revision (GMT):
Friday, 07 June 2024, 12:40:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
电容器
Capacitor 1
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 2
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 3
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 4
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 5
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 6
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 7
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
电感
Inductor 1
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

防护涂料
Protective Coating
OOOOOO

镀锡
Tin Plating
OOOOOO
电感
Inductor 2
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

防护涂料
Protective Coating
OOOOOO

镀锡
Tin Plating
OOOOOO
电感
Inductor 3
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

防护涂料
Protective Coating
OOOOOO

镀锡
Tin Plating
OOOOOO
电感
Inductor 4
内电极
Inner Electrode
OOOOOO

绝缘
Insulation
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

防护涂料
Protective Coating
OOOOOO

镀锡
Tin Plating
OOOOOO
电阻
Resistor
氧化铝基材
Alumina Substrate
OOOOOO

底导体
Bottom Conductor
OOOOOO


Glaze
XOOOOO

镀镍层
Nickel Plating
OOOOOO

防护涂料
Protective Coating
OOOOOO

电阻层
Resistive Layer
XOOOOO

溅射
Sputter
OOOOOO

镀锡
Tin Plating
OOOOOO

顶部电导体
Top Conductor
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
助焊剂
Solder Flux
助焊剂
Solder Flux
OOOOOO
焊锡膏
Solder Paste
焊锡膏
Solder Paste
OOOOOO
基板,预镀镍钯金
Substrate, Pre-plated NiPdAu
基板,预镀镍钯金
Substrate, Pre-plated NiPdAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of AFSC5G26F38T2Last Revision (GMT):
Friday, 07 June 2024, 12:40:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
21 May 2024
Test Report
21 May 2024
Test Report
21 May 2024
Test Report
21 May 2024
Capacitor 1CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Capacitor 2CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Capacitor 3CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Capacitor 4CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Capacitor 5CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
Capacitor 6CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Capacitor 7CERAMICTest Report
12 Dec 2022
Test Report
12 Dec 2022
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
Die EncapsulantTest Report
30 Jan 2024
Test Report
30 Jan 2024
Test Report
30 Jan 2024
Test Report
30 Jan 2024
Epoxy AdhesiveTest Report
14 Apr 2023
Test Report
14 Apr 2023
Test Report
14 Apr 2023
Test Report
14 Apr 2023
Inductor 1ELECTRODETest Report
1 Jun 2023
Test Report
1 Jun 2023
Test Report
14 Jun 2022
Test Report
14 Jun 2022
INNER GLAZETest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
24 Sep 2021
Test Report
24 Sep 2021
NI PLATINGTest Report
23 Apr 2023
Test Report
23 Apr 2023
Test Report
20 May 2022
Test Report
20 May 2022
OUTER GLAZETest Report
1 Nov 2022
Test Report
1 Nov 2022
Test Report
15 Nov 2021
Test Report
15 Nov 2021
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Inductor 2ELECTRODETest Report
14 Jun 2022
Test Report
14 Jun 2022
Not AvailableNot Available
ELECTRODE (BA)Not AvailableNot AvailableTest Report
14 Jun 2022
Test Report
14 Jun 2022
GLAZE (BB)Not AvailableNot AvailableTest Report
28 Oct 2020
Test Report
28 Oct 2020
GLAZE (BC)Not AvailableNot AvailableTest Report
27 Nov 2020
Test Report
27 Nov 2020
INNER GLAZETest Report
14 Sep 2022
Test Report
14 Sep 2022
Not AvailableNot Available
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER GLAZETest Report
1 Nov 2022
Test Report
1 Nov 2022
Not AvailableNot Available
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Inductor 3ELECTRODETest Report
14 Jun 2022
Test Report
14 Jun 2022
Not AvailableNot Available
ELECTRODE (BA)Not AvailableNot AvailableTest Report
14 Jun 2022
Test Report
14 Jun 2022
GLAZE (BB)Not AvailableNot AvailableTest Report
28 Oct 2020
Test Report
28 Oct 2020
GLAZE (BC)Not AvailableNot AvailableTest Report
27 Nov 2020
Test Report
27 Nov 2020
INNER GLAZETest Report
14 Sep 2022
Test Report
14 Sep 2022
Not AvailableNot Available
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER GLAZETest Report
1 Nov 2022
Test Report
1 Nov 2022
Not AvailableNot Available
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Inductor 4ELECTRODETest Report
14 Jun 2022
Test Report
14 Jun 2022
Not AvailableNot Available
ELECTRODE (BA)Not AvailableNot AvailableTest Report
18 Jul 2020
Test Report
18 Jul 2020
GLAZE (BB)Not AvailableNot AvailableTest Report
28 Oct 2020
Test Report
28 Oct 2020
GLAZE (BC)Not AvailableNot AvailableTest Report
27 Nov 2020
Test Report
27 Nov 2020
INNER GLAZETest Report
31 Aug 2023
Test Report
31 Aug 2023
Not AvailableNot Available
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
25 Jun 2021
OUTER GLAZETest Report
18 Oct 2023
Test Report
18 Oct 2023
Not AvailableNot Available
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
ResistorCERAMICTest Report
13 Feb 2020
Test Report
13 Feb 2020
Test Report
13 Feb 2020
Test Report
13 Feb 2020
INTERNAL ELECTRODETest Report
27 Dec 2019Test Report
15 Sep 2020
Test Report
27 Dec 2019Test Report
15 Sep 2020
Test Report
27 Dec 2019Test Report
15 Sep 2020
Test Report
27 Dec 2019
NI PLATINGTest Report
1 Sep 2020
Test Report
1 Sep 2020
Test Report
1 Sep 2020
Test Report
1 Sep 2020
OVERCOATTest Report
28 Jul 2020
Test Report
28 Jul 2020
Not AvailableNot Available
OVERGLAZETest Report
12 Nov 2020
Test Report
12 Nov 2020
Test Report
12 Nov 2020
Test Report
12 Nov 2020
RESISTIVE LAYERTest Report
16 Nov 2020
Test Report
16 Nov 2020
Not AvailableNot Available
SN PLATINGTest Report
1 Jun 2020
Test Report
1 Jun 2020
Test Report
1 Jun 2020
Test Report
1 Jun 2020
Semiconductor Die 1Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Semiconductor Die 2Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Solder FluxTest Report
12 Oct 2023
Test Report
12 Oct 2023
Not AvailableNot Available
Solder PasteTest Report
22 Nov 2023
Test Report
22 Nov 2023
Test Report
22 Nov 2023
Test Report
22 Nov 2023
Substrate, Pre-plated NiPdAuAU PLATINGTest Report
25 Nov 2022
Test Report
25 Nov 2022
Test Report
25 Nov 2022
Test Report
25 Nov 2022
AUS SR-1Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
COPPER FOILTest Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
CU PLATINGTest Report
2 May 2022
Test Report
2 May 2022
Test Report
2 May 2022
Test Report
2 May 2022
GHPL-970LFTest Report
6 Apr 2020
Test Report
6 Apr 2020
Test Report
8 Feb 2023
Test Report
6 Apr 2020
NI PLATINGTest Report
26 Jun 2023
Test Report
26 Jun 2023
Test Report
26 Jun 2023
Test Report
26 Jun 2023
PD PLATINGTest Report
5 Dec 2022
Test Report
5 Dec 2022
Test Report
5 Dec 2022
Test Report
5 Dec 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.