B4860NXN7QUMD

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of B4860NXN7QUMDLast Revision (GMT):
Monday, 02 August 2021, 11:39:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
B4860NXN7QUMDSOT1617-1BGA10207374.011000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 220 755572021-02-0553 / 168 hours25030 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-737.48000040.0000000.508271
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-614.05500015.0000000.190602
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-242.16500045.0000000.571805
Subtotal93.700000100.00000001.270679
Heat SpreaderHeat SpreaderCopper and its compoundsCopper, metal7440-50-85170.74821898.86120070.121244
Nickel and its compoundsNickel, metal7440-02-059.5627821.1388000.807739
Subtotal5230.311000100.000000070.928983
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped138.79040089.6000001.882156
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.3941000.9000000.018906
Nickel and its compoundsNickel, metal7440-02-00.7745000.5000000.010503
Silver and its compoundsSilver, metal7440-22-40.4879350.3150000.006617
Tin and its compoundsTin, metal7440-31-513.4530658.6850000.182439
Subtotal154.900000100.00000002.100621
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-84.2816930.5009000.058065
Silver and its compoundsSilver, metal7440-22-425.6901593.0054000.348388
Tin and its compoundsTin, metal7440-31-5824.82814896.49370011.185610
Subtotal854.800000100.000000011.592063
SubstrateSubstrateAluminum and its compoundsAluminum Hydroxide21645-51-260.1146786.6757000.815224
Barium and its compoundsBarium sulfate7727-43-7113.28109912.5798001.536221
Copper and its compoundsCopper phthalocyanine147-14-80.1503840.0167000.002039
Copper and its compoundsCopper, metal7440-50-8469.46847152.1342006.366528
Epoxy ResinsOther Epoxy resins30.0577893.3379000.407618
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.9995550.1110000.013555
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-63.1175310.3462000.042277
Inorganic Silicon compoundsFibrous-glass-wool65997-17-375.1440248.3447001.019039
Inorganic Silicon compoundsSilicon dioxide7631-86-99.2265231.0246000.125122
Magnesium and its compoundsTalc14807-96-625.1050402.7879000.340453
Organic compoundsCyclohexanone108-94-123.9469972.6593000.324749
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-613.2607631.4726000.179831
Polymers2-Oxiranemethanamine,N-[2-methyl-4-(2-oxiranylmethoxy)phenyl]-N-(2-oxiranylmethyl)-110656-67-21.4993320.1665000.020333
PolymersOther acrylic/epoxy resin mixture12.1819641.3528000.165201
PolymersOther polymers4.9599540.5508000.067263
Silver and its compoundsSilver, metal7440-22-41.7334620.1925000.023508
Tin and its compoundsTin, metal7440-31-556.2524346.2468000.762847
Subtotal900.500000100.000000012.211807
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-567.46400072.0000000.914889
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.9370001.0000000.012707
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones8.4330009.0000000.114361
Zinc and its compoundsZinc oxide1314-13-216.86600018.0000000.228722
Subtotal93.700000100.00000001.270679
UnderfillUnderfillInorganic Silicon compoundsSilica, vitreous60676-86-027.66000060.0000000.375101
Inorganic compoundsCarbon Black1333-86-40.0461000.1000000.000625
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.4149000.9000000.005627
PolymersPlastic: EP - Epoxide, Epoxy17.97900039.0000000.243816
Subtotal46.100000100.00000000.625169
Total7374.011000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 B4860NXN7QUMD
Product content declaration of B4860NXN7QUMD
上次修订 Last Revision (GMT):
Monday, 02 August 2021, 11:39:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
散热片
Heat Spreader
散热片
Heat Spreader
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of B4860NXN7QUMDLast Revision (GMT):
Monday, 02 August 2021, 11:39:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Epoxy AdhesiveTest Report
3 Mar 2021
Test Report
3 Mar 2021
Test Report
3 Mar 2021
Test Report
3 Mar 2021
Heat SpreaderNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
Solder Ball - SAC, Lead FreeTest Report
7 Aug 2020
Test Report
7 Aug 2020
Test Report
7 Aug 2020
Test Report
7 Aug 2020
SubstrateNot AvailableNot AvailableNot AvailableNot Available
Thermally Conductive GelTest Report
30 Sep 2020
Test Report
30 Sep 2020
Test Report
30 Sep 2020
Test Report
30 Sep 2020
UnderfillTest Report
18 Feb 2021
Test Report
18 Feb 2021
Test Report
10 Mar 2020
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.