BGA7350,115

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of BGA7350,115Last Revision (GMT):
Sunday, 10 April 2022, 11:38:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
BGA7350,115SOT617-1HVQFN3265.558738 mg YesYesYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9352 934 171152022-03-17111 / Unlimited26030 sec.1 / Unlimited24020 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuAluminum and its compoundsAluminum, metal7429-90-50.0000040.0010000.000007
Calcium and its compoundsCalcium7440-70-20.0000090.0020000.000013
Copper and its compoundsCopper, metal7440-50-80.0000040.0010000.000007
Gold and its compoundsGold, metal7440-57-50.43653498.8420000.665867
Iron and its compoundsIron, metal7439-89-60.0000040.0010000.000007
Magnesium and its compoundsMagnesium, metal7439-95-40.0000040.0010000.000007
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000040.0010000.000007
Palladium and its compoundsPalladium, metal7440-05-30.0050791.1500000.007747
Silver and its compoundsSilver, metal7440-22-40.0000040.0010000.000007
Subtotal0.441648100.00000000.673667
Copper Lead-Frame, Pre-Plated NiPdAuCopper Lead-Frame, Pre-Plated NiPdAuCopper and its compoundsCopper, metal7440-50-824.36750097.47000037.168958
Iron and its compoundsIron, metal7439-89-60.6000002.4000000.915210
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0075000.0300000.011440
Zinc and its compoundsZinc, metal7440-66-60.0250000.1000000.038134
Subtotal25.000000100.000000038.133742
Die EncapsulantDie EncapsulantEpoxy ResinsOther Non-halogenated Epoxy resins1.3346643.6072002.035829
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-60.5719831.5459000.872474
Inorganic Silicon compoundsSilica, vitreous60676-86-031.59085985.38070048.187107
Inorganic compoundsCarbon Black1333-86-40.0673030.1819000.102661
Magnesium and its compoundsMagnesium dihydroxide1309-42-81.3271903.5870002.024429
Organic Phosphorus compoundsOther organic phosphorous compounds0.0293410.0793000.044755
Phenols and Phenolic Resins1,3,5-Triazine-2,4,6-triamine, polymer with formaldehyde and phenol25917-04-80.1169570.3161000.178400
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-61.3448393.6347002.051350
Zinc and its compoundsZinc Hydroxide20427-58-10.6168641.6672000.940933
Subtotal37.000000100.000000056.437938
Epoxy AdhesiveEpoxy AdhesiveAcrylatesProprietary Material-Other Methacrylate compounds0.0165473.3094000.025240
AcrylatesProprietary Material-Other acrylates0.0441268.8252000.067308
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-50.0165473.3094000.025240
Palladium and its compoundsPalladium, metal7440-05-30.0008280.1655000.001262
PolymersProprietary Material-Other polymers0.0082731.6547000.012620
Silver and its compoundsSilver, metal7440-22-40.41367982.7358000.631005
Subtotal0.500000100.00000000.762675
Pre-plating - Precious metal - OtherPre-plating - Precious metal - OtherGold and its compoundsGold, metal7440-57-50.0270003.0000000.041184
Nickel and its compoundsNickel, metal7440-02-00.83070092.3000001.267108
Palladium and its compoundsPalladium, metal7440-05-30.0279003.1000000.042557
Silver and its compoundsSilver, metal7440-22-40.0144001.6000000.021965
Subtotal0.900000100.00000001.372815
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-31.68274898.0000002.566779
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0343422.0000000.052383
Subtotal1.717090100.00000002.619163
Total65.558738100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 BGA7350,115
Product content declaration of BGA7350,115
上次修订 Last Revision (GMT):
Sunday, 10 April 2022, 11:38:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
预电镀-贵金属-其它
Pre-plating - Precious metal - Other
预电镀-贵金属-其它
Pre-plating - Precious metal - Other
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of BGA7350,115Last Revision (GMT):
Sunday, 10 April 2022, 11:38:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Copper Lead-Frame, Pre-Plated NiPdAuC194Test Report
3 Jan 2022
Test Report
3 Jan 2022
Test Report
3 Jan 2022
Test Report
3 Jan 2022
NI PLATINGTest Report
7 Jan 2022
Test Report
7 Jan 2022
Test Report
7 Jan 2022
Test Report
7 Jan 2022
PD PLATINGTest Report
7 Jan 2022
Test Report
7 Jan 2022
Test Report
7 Jan 2022
Test Report
7 Jan 2022
Die EncapsulantTest Report
10 Dec 2021
Test Report
10 Dec 2021
Test Report
10 Dec 2021
Test Report
10 Dec 2021
Epoxy AdhesiveTest Report
11 Jan 2022
Test Report
11 Jan 2022
Test Report
11 Jan 2022
Test Report
11 Jan 2022
Pre-plating - Precious metal - OtherNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.