BGU6009/N2X

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of BGU6009/N2XLast Revision (GMT):
Wednesday, 26 April 2023, 01:37:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
BGU6009/N2XSOT1230XSON61.301640 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9340 681 911152024-04-1671 / Unlimited26030 sec.1 / Unlimited24020 sec.3Seremban, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.02450299.0000001.882433
Palladium and its compoundsPalladium, metal7440-05-30.0002471.0000000.019015
Subtotal0.024750100.00000001.901447
Copper Lead-Frame, Pre-Plated NiPdAuCopper AlloyCopper and its compoundsCopper, metal7440-50-80.49386496.20000037.941663
Inorganic Silicon compoundsSilicon7440-21-30.0033370.6500000.256363
Magnesium and its compoundsMagnesium, metal7439-95-40.0007700.1500000.059161
Nickel and its compoundsNickel, metal7440-02-00.0154013.0000001.183212
Subtotal0.513372100.000000039.440398
Gold PlatingGold and its compoundsGold, metal7440-57-50.00099999.9900000.076818
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000008
Subtotal0.001000100.00000000.076826
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000112
Nickel and its compoundsNickel, metal7440-02-00.01462799.9900001.123701
Subtotal0.014628100.00000001.123813
Palladium PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000008
Palladium and its compoundsPalladium, metal7440-05-30.00099999.9900000.076818
Subtotal0.001000100.00000000.076826
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins0.0186003.0000001.428967
Inorganic Silicon compoundsSilica, vitreous60676-86-00.43400070.00000033.342552
Inorganic Silicon compoundsSilicon dioxide7631-86-90.12710020.5000009.764605
Inorganic compoundsCarbon Black1333-86-40.0031000.5000000.238161
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.0186003.0000001.428967
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.0186003.0000001.428967
Subtotal0.620000100.000000047.632218
Epoxy AdhesiveEpoxy AdhesiveAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.00800040.0000000.614609
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0010005.0000000.076826
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.00200010.0000000.153652
PolymersAcrylonitrile-methyl-methacrylate-vinylidene chloride copolymer25036-25-30.00300015.0000000.230479
PolymersProprietary Material-Other acrylic/epoxy resin mixture0.00600030.0000000.460957
Subtotal0.020000100.00000001.536523
Post-plating - Lead FreePost-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0000010.0030000.000069
Bismuth and its compoundsBismuth, metal7440-69-90.0000010.0010000.000023
Copper and its compoundsCopper, metal7440-50-80.0000010.0010000.000023
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000020.0050000.000115
Tin and its compoundsTin, metal7440-31-50.02999699.9900002.304554
Subtotal0.030000100.00000002.304785
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-30.07535298.0000005.789020
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0015382.0000000.118143
Subtotal0.076890100.00000005.907163
Total1.301640100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 BGU6009/N2X
Product content declaration of BGU6009/N2X
上次修订 Last Revision (GMT):
Wednesday, 26 April 2023, 01:37:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
铜合金
Copper Alloy
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

钯镀层
Palladium Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of BGU6009/N2XLast Revision (GMT):
Wednesday, 26 April 2023, 01:37:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
3 Jul 2024
Test Report
3 Jul 2024
Test Report
3 Jul 2024
Test Report
3 Jul 2024
Copper Lead-Frame, Pre-Plated NiPdAuAU PLATINGTest Report
19 Apr 2024
Test Report
19 Apr 2024
Test Report
19 Apr 2024
Test Report
19 Apr 2024
C7025Test Report
2 Feb 2024
Test Report
2 Feb 2024
Test Report
2 Feb 2024
Test Report
2 Feb 2024
NI PLATINGTest Report
19 Apr 2024
Test Report
19 Apr 2024
Test Report
19 Apr 2024
Test Report
19 Apr 2024
PD PLATINGTest Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
Test Report
19 Apr 2023
Die EncapsulantTest Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Epoxy AdhesiveTest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Post-plating - Lead FreeTest Report
19 Jan 2024
Test Report
19 Jan 2024
Test Report
19 Jan 2024
Test Report
19 Jan 2024
Semiconductor DieTest Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.