BGU7031,115

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of BGU7031,115Last Revision (GMT):
Wednesday, 27 April 2022, 11:27:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
BGU7031,115SOT363TSSOP65.440050 mg YesYesYesTin (Sn)Alloy42e3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9340 646 581152021-12-0861 / Unlimited26030 sec.1 / Unlimited24020 sec.3Seremban, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuBeryllium and its compoundsBeryllium, metal7440-41-70.0000010.0010000.000003
Gold and its compoundsGold, metal7440-57-50.01768799.9900000.325148
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000020.0090000.000029
Subtotal0.017690100.00000000.325181
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins0.43650015.0000008.023823
Inorganic Silicon compoundsSilicon dioxide7631-86-92.09520072.00000038.514352
Inorganic compoundsCarbon Black1333-86-40.0145500.5000000.267461
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0582002.0000001.069843
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.29100010.0000005.349215
Phosphorus compoundsTriphenyl phosphine603-35-00.0145500.5000000.267461
Subtotal2.910000100.000000053.492155
Epoxy AdhesiveEpoxy AdhesiveAromatic amines and their salts3-Aminophenyl sulfone599-61-10.0005005.0000000.009191
Inorganic Silicon compoundsSilicon dioxide7631-86-90.00500050.0000000.091911
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0004004.0000000.007353
Organic compoundsN,N'-Bismaleimido-4,4'-diphenylmethane35325-39-40.00100010.0000000.018382
Phenols and Phenolic ResinsCumyl hydroperoxide80-15-90.0001001.0000000.001838
PolymersAcrylonitrile-methyl-methacrylate-vinylidene chloride copolymer25036-25-30.00200020.0000000.036764
PolymersProprietary Material-Other acrylic/epoxy resin mixture0.00100010.0000000.018382
Subtotal0.010000100.00000000.183822
Iron Lead-Frame, Pre-PlatedIron Lead-Frame, Pre-PlatedAluminum and its compoundsAluminum, metal7429-90-50.0019900.1000000.036581
Chromium and Chromium III compoundsChromium, metal7440-47-30.0049750.2500000.091451
Cobalt and its compoundsCobalt, metal7440-48-40.0099500.5000000.182903
Copper and its compoundsCopper, metal7440-50-80.0165170.8300000.303619
Inorganic Silicon compoundsSilicon7440-21-30.0059700.3000000.109742
Inorganic compoundsCarbon7440-44-00.0009950.0500000.018290
Inorganic compoundsProprietary Material - Other inorganic compounds0.0005970.0300000.010974
Iron and its compoundsIron, metal7439-89-61.09828155.19000020.188803
Manganese and its compoundsManganese, metal7439-96-50.0199001.0000000.365806
Nickel and its compoundsNickel, metal7440-02-00.82764141.59000015.213849
Phosphorus compoundsProprietary Material-Other inorganic phosphorous compounds0.0005970.0300000.010974
Silver and its compoundsSilver, metal7440-22-40.0025870.1300000.047555
Subtotal1.990000100.000000036.580546
Post-plating - Lead FreePost-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0000110.0030000.000204
Bismuth and its compoundsBismuth, metal7440-69-90.0000040.0010000.000068
Copper and its compoundsCopper, metal7440-50-80.0000040.0010000.000068
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000180.0050000.000340
Tin and its compoundsTin, metal7440-31-50.36996399.9900006.800728
Subtotal0.370000100.00000006.801408
Semiconductor ComponentSemiconductor ComponentInorganic Silicon compoundsSilicon7440-21-30.13951398.0000002.564550
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0028472.0000000.052338
Subtotal0.142360100.00000002.616888
Total5.440050100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 BGU7031,115
Product content declaration of BGU7031,115
上次修订 Last Revision (GMT):
Wednesday, 27 April 2022, 11:27:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
铁铅框架,预镀
Iron Lead-Frame, Pre-Plated
铁铅框架,预镀
Iron Lead-Frame, Pre-Plated
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体元件
Semiconductor Component
半导体元件
Semiconductor Component
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of BGU7031,115Last Revision (GMT):
Wednesday, 27 April 2022, 11:27:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Die EncapsulantTest Report
18 May 2021
Test Report
18 May 2021
Test Report
18 May 2021
Test Report
18 May 2021
Epoxy AdhesiveTest Report
29 Jan 2021
Test Report
29 Jan 2021
Test Report
29 Jan 2021
Test Report
29 Jan 2021
Iron Lead-Frame, Pre-PlatedNot AvailableNot AvailableNot AvailableNot Available
Post-plating - Lead FreeTest Report
28 May 2021
Test Report
28 May 2021
Test Report
28 May 2021
Test Report
28 May 2021
Semiconductor ComponentTest Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.