BGU7062N2Y

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of BGU7062N2YLast Revision (GMT):
Monday, 27 June 2022, 05:47:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
BGU7062N2YSOT1301-1HLLGA16178.332750 mg YesYesYesNot ApplicableOtherNot Applicablecontact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 005 755182021-12-0843 / 168 hours26030 sec.NA / Not Available24020 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuCalcium and its compoundsCalcium7440-70-20.0000050.0020000.000003
Gold and its compoundsGold, metal7440-57-50.23226498.8400000.130242
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000190.0080000.000010
Palladium and its compoundsPalladium, metal7440-05-30.0027021.1500000.001515
Subtotal0.234990100.00000000.131771
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins14.42000010.3000008.086008
Inorganic Silicon compoundsOther silica compounds125.58000089.70000070.418922
Subtotal140.000000100.000000078.504930
Epoxy AdhesiveEpoxy AdhesiveAcrylatesIsobornyl methacrylate7534-94-30.03000010.0000000.016823
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0060002.0000000.003364
Organic compoundsN,N'-Bismaleimido-4,4'-diphenylmethane35325-39-40.03000010.0000000.016823
Silver and its compoundsSilver, metal7440-22-40.23400078.0000000.131215
Subtotal0.300000100.00000000.168225
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon7440-21-30.79457498.0000000.445557
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0162162.0000000.009093
Subtotal0.810790100.00000000.454650
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon7440-21-30.96723198.0000000.542374
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0197392.0000000.011069
Subtotal0.986970100.00000000.553443
SubstrateCopper FoilChromium and Chromium III compoundsChromium, metal7440-47-30.0013830.0100000.000775
Copper and its compoundsCopper, metal7440-50-813.81890699.9500007.748945
Zinc and its compoundsZinc, metal7440-66-60.0055300.0400000.003101
Subtotal13.825819100.00000007.752821
Copper PlatingCopper and its compoundsCopper, metal7440-50-811.01049299.9500006.174128
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0055080.0500000.003089
Subtotal11.016000100.00000006.177217
Gold PlatingGold and its compoundsGold, metal7440-57-51.14468699.9900000.641882
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001150.0100000.000064
Subtotal1.144800100.00000000.641946
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0011450.2000000.000642
Nickel and its compoundsNickel, metal7440-02-00.57125599.8000000.320331
Subtotal0.572400100.00000000.320973
Palladium PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0015260.2000000.000856
Palladium and its compoundsPalladium, metal7440-05-30.76167499.8000000.427108
Subtotal0.763200100.00000000.427964
Solder MaskBarium and its compoundsBarium sulfate7727-43-70.89465029.1000000.501675
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0184460.6000000.010344
Magnesium and its compoundsTalc14807-96-60.0922323.0000000.051719
Organic compoundsOther organic compounds.0.1106783.6000000.062063
PolymersPlastic: EP - Epoxide, Epoxy0.60258219.6000000.337898
PolymersPlastic: PAK1.35581044.1000000.760270
Subtotal3.074400100.00000001.723968
Substrate CoreAluminum and its compoundsAluminum hydroxide oxide24623-77-61.22153721.8000000.684976
Inorganic Silicon compoundsFibrous-glass-wool65997-17-32.51031544.8000001.407658
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0672411.2000000.037705
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3586166.4000000.201094
Phenols - SpecificBisphenol A80-05-70.0560341.0000000.031421
PolymersBT Resin (CAS# 13676-54-5/25722-66-1) [Brominated Compound]0.80688714.4000000.452461
PolymersPlastic: EP - Epoxide, Epoxy0.58275210.4000000.326778
Subtotal5.603381100.00000003.142093
Total178.332750100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 BGU7062N2Y
Product content declaration of BGU7062N2Y
上次修订 Last Revision (GMT):
Monday, 27 June 2022, 05:47:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

钯镀层
Palladium Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of BGU7062N2YLast Revision (GMT):
Monday, 27 June 2022, 05:47:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Test Report
4 Aug 2021
Die EncapsulantTest Report
3 Dec 2021
Test Report
3 Dec 2021
Test Report
3 Dec 2021
Test Report
3 Dec 2021
Epoxy AdhesiveTest Report
5 Jul 2021
Test Report
5 Jul 2021
Test Report
18 Sep 2020
Test Report
18 Sep 2020
Semiconductor Die 1Test Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
Semiconductor Die 2Test Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
Test Report
23 Jun 2021
SubstrateAU PLATINGTest Report
7 May 2021
Test Report
7 May 2021
Test Report
7 May 2021
Test Report
7 May 2021
AUS 308Test Report
18 Oct 2021
Test Report
18 Oct 2021
Not AvailableNot Available
AUS308Not AvailableNot AvailableTest Report
18 Oct 2021
Test Report
18 Oct 2021
COPPERTest Report
1 Mar 2022
Test Report
1 Mar 2022
Test Report
1 Mar 2022
Test Report
1 Mar 2022
CU PLATINGTest Report
7 May 2021
Test Report
7 May 2021
Test Report
7 May 2021
Test Report
7 May 2021
HL832NXATest Report
11 Mar 2022
Test Report
11 Mar 2022
Test Report
11 Mar 2022
Test Report
11 Mar 2022
NI PLATINGTest Report
7 May 2021
Test Report
7 May 2021
Test Report
7 May 2021
Test Report
7 May 2021
PD PLATINGTest Report
21 Jun 2021
Test Report
21 Jun 2021
Not AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.