BSC9131NLE1HHHB

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of BSC9131NLE1HHHBLast Revision (GMT):
Wednesday, 06 March 2024, 07:31:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
BSC9131NLE1HHHBSOT1641-1FBGA5201258.888000 mg NoNoNoTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 218 855572024-02-2711Not ApplicableNot ApplicableNot Applicable3 / 168 hours24530 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped80.01180089.1000006.355752
Lead and its compoundsLead, metallic lead and lead alloys7439-92-18.4570959.4177000.671791
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8082000.9000000.064200
Nickel and its compoundsNickel, metal7440-02-00.0740850.0825000.005885
Tin and its compoundsTin, metal7440-31-50.4450490.4956000.035353
Titanium and its compoundsTitanium, metal7440-32-60.0037720.0042000.000300
Subtotal89.800000100.00000007.133280
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-81.2632100.5009000.100343
Silver and its compoundsSilver, metal7440-22-47.5792583.0054000.602060
Tin and its compoundsTin, metal7440-31-5243.34553296.49370019.330197
Subtotal252.188000100.000000020.032600
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-8238.16061299.99000018.918332
Epoxy ResinsOther Epoxy resins0.0238180.0100000.001892
Subtotal238.184430100.000000018.920224
Solder BallLead and its compoundsLead, metallic lead and lead alloys7439-92-17.16816537.0000000.569404
Tin and its compoundsTin, metal7440-31-512.20525563.0000000.969527
Subtotal19.373420100.00000001.538931
Solder MaskBarium and its compoundsBarium sulfate7727-43-710.83961031.1000000.861046
Copper and its compoundsCopper phthalocyanine147-14-80.0697080.2000000.005537
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1742700.5000000.013843
Magnesium and its compoundsTalc14807-96-61.2547463.6000000.099671
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.3833951.1000000.030455
Organic compoundsProprietary Material-Other organic compounds.0.0348540.1000000.002769
PolymersPlastic: EP - Epoxide, Epoxy22.09746863.4000001.755316
Subtotal34.854050100.00000002.768638
Substrate Build UpEpoxy ResinsBisphenol A diglycidyl ether1675-54-312.43299220.8400000.987617
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-56.21053010.4100000.493335
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-63.1022825.2000000.246430
Inorganic Silicon compoundsSilicon dioxide7631-86-912.43299220.8400000.987617
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-41.8613693.1200000.147858
PolymersPlastic: EP - Epoxide, Epoxy23.61910539.5900001.876188
Subtotal59.659270100.00000004.739045
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3276.61441550.00000021.972917
Inorganic Silicon compoundsSilica, vitreous60676-86-027.6614415.0000002.197292
PolymersPlastic: EP - Epoxide, Epoxy248.95297445.00000019.775625
Subtotal553.228830100.000000043.945834
UnderfillUnderfillAliphatic AminesProprietary Material-Other aliphatic amines0.8120007.0000000.064501
Aniline and its saltsp-(2,3-epoxypropoxy)-N,N-bis(2,3-epoxypropyl)aniline5026-74-41.16000010.0000000.092145
Bismuth and its compoundsBismuth nitrate10361-44-10.0464000.4000000.003686
Bismuth and its compoundsBismuth trioxide1304-76-30.0464000.4000000.003686
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.16000010.0000000.092145
Inorganic Silicon compoundsSilica, vitreous60676-86-07.54000065.0000000.598941
Inorganic compoundsCarbon Black1333-86-40.1160001.0000000.009215
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.2552002.2000000.020272
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.4640004.0000000.036858
Subtotal11.600000100.00000000.921448
Total1258.888000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 BSC9131NLE1HHHB
Product content declaration of BSC9131NLE1HHHB
上次修订 Last Revision (GMT):
Wednesday, 06 March 2024, 07:31:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
XOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

焊锡球
Solder Ball
XOOOOO

阻焊层
Solder Mask
OOOOOO

有机底物堆积
Substrate Build Up
OOOOOO

有机基质芯
Substrate Core
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of BSC9131NLE1HHHBLast Revision (GMT):
Wednesday, 06 March 2024, 07:31:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Semiconductor DieTest Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - SAC, Lead FreeTest Report
6 Oct 2023
Test Report
6 Oct 2023
Test Report
6 Oct 2023
Test Report
6 Oct 2023
SubstrateCU FOILTest Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
14 Dec 2022
E679FG SERIESTest Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
14 Dec 2022
Test Report
21 Dec 2021
UnderfillTest Report
6 Dec 2022
Test Report
6 Dec 2022
Test Report
6 Dec 2022
Test Report
17 Jan 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.