CLRC66303EVY

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of CLRC66303EVYLast Revision (GMT):
Monday, 26 August 2024, 08:46:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
CLRC66303EVYSOT1985-1VFBGA3623.214510 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 804 295182023-11-2523 / 168 hours26030 sec.3 / 168 hours24020 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-80.05762397.8650000.248219
Gold and its compoundsGold, metal7440-57-50.0000790.1350000.000342
Palladium and its compoundsPalladium, metal7440-05-30.0011782.0000000.005073
Subtotal0.058880100.00000000.253634
Die EncapsulantDie EncapsulantInorganic Silicon compoundsSilica, vitreous60676-86-013.69350089.50000058.986815
Inorganic compoundsCarbon Black1333-86-40.0306000.2000000.131814
PolymersPlastic: EP - Epoxide, Epoxy1.57590010.3000006.788427
Subtotal15.300000100.000000065.907055
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.06240039.0000000.268797
Phenols and Phenolic ResinsOther phenolic resins0.03840024.0000000.165414
PolymersAcrylic acid ester copolymer78506-70-40.02240014.0000000.096491
PolymersProprietary Material-Other acrylic/epoxy resin mixture0.03680023.0000000.158522
Subtotal0.160000100.00000000.689224
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-30.90711798.0000003.907545
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0185132.0000000.079746
Subtotal0.925630100.00000003.987291
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.0288500.5000000.124276
Silver and its compoundsSilver, metal7440-22-40.0577001.0000000.248551
Tin and its compoundsTin, metal7440-31-55.68345098.50000024.482317
Subtotal5.770000100.000000024.855144
SubstrateCopper Foil 1Copper and its compoundsCopper, metal7440-50-80.06288799.0000000.270893
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0006351.0000000.002736
Subtotal0.063522100.00000000.273630
Copper Foil 2Copper and its compoundsCopper, metal7440-50-80.00894499.0000000.038529
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000901.0000000.000389
Subtotal0.009035100.00000000.038918
Copper PlatingCopper and its compoundsCopper, metal7440-50-80.27250999.0000001.173873
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0027531.0000000.011857
Subtotal0.275261100.00000001.185730
Gold PlatingGold and its compoundsGold, metal7440-57-50.00795599.0000000.034268
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000801.0000000.000346
Subtotal0.008035100.00000000.034614
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0008951.0000000.003855
Nickel and its compoundsNickel, metal7440-02-00.08859299.0000000.381625
Subtotal0.089487100.00000000.385480
Solder MaskAromatic amines and their salts1,3,5-Triazine-2,4,6-triamine108-78-10.0001120.1000000.000482
Barium and its compoundsBarium sulfate7727-43-70.03258129.1000000.140348
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0006720.6000000.002894
Magnesium and its compoundsTalc14807-96-60.0033593.0000000.014469
Organic compoundsOther organic compounds.0.0040313.6000000.017363
PolymersPlastic: EP - Epoxide, Epoxy0.02183319.5000000.094048
PolymersPlastic: PAK0.04937544.1000000.212692
Subtotal0.111962100.00000000.482295
Substrate CoreAluminum and its compoundsAluminum hydroxide oxide24623-77-60.09650821.8000000.415723
Inorganic Silicon compoundsFibrous-glass-wool65997-17-30.19832844.8000000.854329
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0053121.2000000.022884
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0283336.4000000.122047
Phenols - SpecificBisphenol A80-05-70.0044271.0000000.019070
PolymersBT Resin (CAS# 13676-54-5/25722-66-1)0.06374814.4000000.274606
PolymersPlastic: EP - Epoxide, Epoxy0.04604010.4000000.198326
Subtotal0.442697100.00000001.906984
Total23.214510100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 CLRC66303EVY
Product content declaration of CLRC66303EVY
上次修订 Last Revision (GMT):
Monday, 26 August 2024, 08:46:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil 1
OOOOOO

铜箔
Copper Foil 2
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of CLRC66303EVYLast Revision (GMT):
Monday, 26 August 2024, 08:46:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
9 Apr 2024
Test Report
9 Apr 2024
Test Report
9 Apr 2024
Test Report
9 Apr 2024
Die EncapsulantTest Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Epoxy AdhesiveTest Report
7 Feb 2024
Test Report
7 Feb 2024
Test Report
7 Feb 2024
Test Report
7 Feb 2024
Semiconductor DieTest Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Solder Ball - SAC, Lead FreeTest Report
14 Dec 2023
Test Report
14 Dec 2023
Test Report
14 Dec 2023
Test Report
14 Dec 2023
SubstrateAUS308Not AvailableNot AvailableNot AvailableNot Available
COPPERTest Report
4 Jan 2024
Test Report
4 Jan 2024
Not AvailableTest Report
4 Jan 2024
HL832NXANot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.