FS32K144UAT0VMHR

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of FS32K144UAT0VMHRLast Revision (GMT):
Wednesday, 27 December 2023, 04:07:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
FS32K144UAT0VMHRSOT1569LBGA100282.441421 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 698 785182023-11-24103 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-85.88682598.1000002.084264
Gold and its compoundsGold, metal7440-57-50.0060010.1000000.002125
Palladium and its compoundsPalladium, metal7440-05-30.1080151.8000000.038243
Subtotal6.000841100.00000002.124632
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins6.8600005.0000002.428822
Inorganic Silicon compoundsSilica, vitreous60676-86-091.92400067.00000032.546218
Inorganic Silicon compoundsSilicon dioxide7631-86-934.30000025.00000012.144111
Inorganic compoundsCarbon Black1333-86-40.6860000.5000000.242882
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins3.4300002.5000001.214411
Subtotal137.200000100.000000048.576444
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.81000045.0000000.286785
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0001800.0100000.000064
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0900005.0000000.031865
PolymersPlastic: EP - Epoxide, Epoxy0.89982049.9900000.318586
Subtotal1.800000100.00000000.637300
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped26.68106898.0000009.446585
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.5445122.0000000.192787
Subtotal27.225580100.00000009.639372
Solder Ball - Lead FreeSolder Ball - Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0005090.0010000.000180
Antimony and its compoundsAntimony, metal7440-36-00.0254580.0500000.009013
Arsenic and its compoundsArsenic, metal7440-38-20.0152740.0300000.005408
Bismuth and its compoundsBismuth, metal7440-69-90.0152740.0300000.005408
Cadmium and its compoundsCadmium, metal7440-43-90.0010180.0020000.000360
Copper and its compoundsCopper, metal7440-50-80.0152740.0300000.005408
Gold and its compoundsGold, metal7440-57-50.0025460.0050000.000901
Indium and its compoundsIndium, metal7440-74-60.0101830.0200000.003605
Iron and its compoundsIron, metal7439-89-60.0050910.0100000.001803
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0254580.0500000.009013
Nickel and its compoundsNickel, metal7440-02-00.0025460.0050000.000901
Silver and its compoundsSilver, metal7440-22-41.7820253.5000000.630936
Tin and its compoundsTin, metal7440-31-549.01383496.26600017.353628
Zinc and its compoundsZinc, metal7440-66-60.0005090.0010000.000180
Subtotal50.915000100.000000018.026747
SubstrateCopper CoreCopper and its compoundsCopper, metal7440-50-820.45052599.9900007.240625
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0020450.0100000.000724
Subtotal20.452570100.00000007.241349
Copper PlatingCopper and its compoundsCopper, metal7440-50-817.07498499.9800006.045496
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0034160.0200000.001209
Subtotal17.078400100.00000006.046705
Gold PlatingGold and its compoundsGold, metal7440-57-50.32018899.9900000.113364
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000320.0100000.000011
Subtotal0.320220100.00000000.113376
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0006120.0300000.000217
Nickel and its compoundsNickel, metal7440-02-02.03930899.9700000.722029
Subtotal2.039920100.00000000.722245
Solder MaskBarium and its compoundsBarium sulfate7727-43-74.59707829.1000001.627622
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0947850.6000000.033559
Magnesium and its compoundsTalc14807-96-60.4739263.0000000.167796
Organic compoundsOther organic compounds.0.5687113.6000000.201355
PolymersPlastic: EP - Epoxide, Epoxy3.09631419.6000001.096268
PolymersPlastic: PAK6.96670644.1000002.466602
Subtotal15.797520100.00000005.593202
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-31.68542646.6700000.596735
Inorganic Silicon compoundsSilica, vitreous60676-86-00.2405176.6600000.085156
PolymersPlastic: PI - Polyimide1.68542646.6700000.596735
Subtotal3.611370100.00000001.278626
Total282.441421100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 FS32K144UAT0VMHR
Product content declaration of FS32K144UAT0VMHR
上次修订 Last Revision (GMT):
Wednesday, 27 December 2023, 04:07:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板
Substrate
铜芯
Copper Core
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of FS32K144UAT0VMHRLast Revision (GMT):
Wednesday, 27 December 2023, 04:07:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Test Report
15 Sep 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Test Report
2 Jun 2023
Semiconductor DieTest Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Test Report
28 Mar 2023
Solder Ball - Lead FreeTest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
SubstrateAUS308Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
COPPER FOILTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
E679FG SERIESTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.