FS32V234CKN1VUBR

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of FS32V234CKN1VUBRLast Revision (GMT):
Thursday, 28 April 2022, 07:47:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
FS32V234CKN1VUBRSOT1840FBGA621829.258000 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 626 395182020-10-1543 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-74.28000040.0000000.516124
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-61.60500015.0000000.193547
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-24.81500045.0000000.580640
Subtotal10.700000100.00000001.290310
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-397.21600098.00000011.723251
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.9840002.0000000.239250
Subtotal99.200000100.000000011.962501
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-45.4025303.5000000.651490
Tin and its compoundsTin, metal7440-31-5148.95547096.50000017.962500
Subtotal154.358000100.000000018.613990
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-8186.29837399.98000022.465671
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0372670.0200000.004494
Subtotal186.335640100.000000022.470165
InsulationEpoxy ResinsBisphenol A diglycidyl ether1675-54-33.39020110.4500000.408824
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-53.39020110.4500000.408824
Inorganic Silicon compoundsSilicon dioxide7631-86-913.57702741.8500001.637250
PolymersPlastic: EP - Epoxide, Epoxy12.08469037.2500001.457289
Subtotal32.442120100.00000003.912187
Solder BallCopper and its compoundsCopper, metal7440-50-80.0856490.5000000.010328
Silver and its compoundsSilver, metal7440-22-40.5138963.0000000.061971
Tin and its compoundsTin, metal7440-31-516.53033496.5000001.993389
Subtotal17.129880100.00000002.065688
Solder MaskBarium and its compoundsBarium sulfate7727-43-74.50279025.0000000.542990
Inorganic Silicon compoundsSilica, vitreous60676-86-01.80111610.0000000.217196
Organic compoundsOther organic compounds.0.9005585.0000000.108598
PolymersPlastic: EP - Epoxide, Epoxy10.80669660.0000001.303177
Subtotal18.011160100.00000002.171961
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3148.44060050.00000017.900412
Inorganic Silicon compoundsSilica, vitreous60676-86-059.37624020.0000007.160165
PolymersPlastic: EP - Epoxide, Epoxy89.06436030.00000010.740247
Subtotal296.881200100.000000035.800824
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-59.50400072.0000001.146085
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones1.32000010.0000000.159178
Zinc and its compoundsZinc oxide1314-13-22.37600018.0000000.286521
Subtotal13.200000100.00000001.591784
UnderfillUnderfillInorganic Silicon compoundsSilica, vitreous60676-86-00.60000060.0000000.072354
Inorganic compoundsCarbon Black1333-86-40.0010000.1000000.000121
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0090000.9000000.001085
PolymersPlastic: EP - Epoxide, Epoxy0.39000039.0000000.047030
Subtotal1.000000100.00000000.120590
Total829.258000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 FS32V234CKN1VUBR
Product content declaration of FS32V234CKN1VUBR
上次修订 Last Revision (GMT):
Thursday, 28 April 2022, 07:47:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

绝缘
Insulation
OOOOOO

焊锡球
Solder Ball
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of FS32V234CKN1VUBRLast Revision (GMT):
Thursday, 28 April 2022, 07:47:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Epoxy AdhesiveTest Report
2 Mar 2022
Test Report
2 Mar 2022
Test Report
2 Mar 2022
Test Report
2 Mar 2022
Semiconductor DieTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Solder Ball - Lead FreeTest Report
28 Apr 2021
Test Report
28 Apr 2021
Test Report
28 Apr 2021
Test Report
13 Mar 2020
SubstrateCU FOILTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
E700GRTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
GX-13Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
Test Report
30 Jul 2021
PHP-900 IR-6Test Report
17 Feb 2022
Test Report
17 Feb 2022
Test Report
17 Feb 2022
Test Report
17 Feb 2022
SR7300GRBTest Report
24 Feb 2022
Test Report
24 Feb 2022
Test Report
24 Feb 2022
Test Report
24 Feb 2022
Thermally Conductive GelTest Report
30 Aug 2021
Test Report
30 Aug 2021
Test Report
30 Aug 2021
Test Report
30 Aug 2021
UnderfillTest Report
17 Jan 2022
Test Report
17 Jan 2022
Test Report
17 Jan 2022
Test Report
17 Jan 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.