FS32V234CKN1VUBR

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of FS32V234CKN1VUBRLast Revision (GMT):
Friday, 08 March 2024, 08:13:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
FS32V234CKN1VUBRSOT1840FBGA621828.358000 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 626 395182023-11-2473 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-70.04000040.0000000.004829
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-60.01500015.0000000.001811
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-20.04500045.0000000.005432
Subtotal0.100000100.00000000.012072
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-397.21600098.00000011.735988
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.9840002.0000000.239510
Subtotal99.200000100.000000011.975499
Solder Ball - Lead FreeSolder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-45.4025303.5000000.652197
Tin and its compoundsTin, metal7440-31-5148.95547096.50000017.982016
Subtotal154.358000100.000000018.634214
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-8186.29837399.98000022.490080
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0372670.0200000.004499
Subtotal186.335640100.000000022.494578
InsulationEpoxy ResinsBisphenol A diglycidyl ether1675-54-33.39020110.4500000.409268
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-53.39020110.4500000.409268
Inorganic Silicon compoundsSilicon dioxide7631-86-913.57702741.8500001.639029
PolymersPlastic: EP - Epoxide, Epoxy12.08469037.2500001.458873
Subtotal32.442120100.00000003.916437
Solder BallCopper and its compoundsCopper, metal7440-50-80.0856490.5000000.010340
Silver and its compoundsSilver, metal7440-22-40.5138963.0000000.062038
Tin and its compoundsTin, metal7440-31-516.53033496.5000001.995554
Subtotal17.129880100.00000002.067932
Solder MaskBarium and its compoundsBarium sulfate7727-43-74.50279025.0000000.543580
Inorganic Silicon compoundsSilica, vitreous60676-86-01.80111610.0000000.217432
Organic compoundsOther organic compounds.0.9005585.0000000.108716
PolymersPlastic: EP - Epoxide, Epoxy10.80669660.0000001.304593
Subtotal18.011160100.00000002.174321
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3148.44060050.00000017.919861
Inorganic Silicon compoundsSilica, vitreous60676-86-059.37624020.0000007.167944
PolymersPlastic: EP - Epoxide, Epoxy89.06436030.00000010.751916
Subtotal296.881200100.000000035.839721
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-57.70400072.0000000.930033
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones1.07000010.0000000.129171
Zinc and its compoundsZinc oxide1314-13-21.92600018.0000000.232508
Subtotal10.700000100.00000001.291712
UnderfillUnderfillInorganic Silicon compoundsSilica, vitreous60676-86-07.92000060.0000000.956108
Inorganic compoundsCarbon Black1333-86-40.0132000.1000000.001594
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1188000.9000000.014342
PolymersPlastic: EP - Epoxide, Epoxy5.14800039.0000000.621470
Subtotal13.200000100.00000001.593514
Total828.358000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 FS32V234CKN1VUBR
Product content declaration of FS32V234CKN1VUBR
上次修订 Last Revision (GMT):
Friday, 08 March 2024, 08:13:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

绝缘
Insulation
OOOOOO

焊锡球
Solder Ball
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of FS32V234CKN1VUBRLast Revision (GMT):
Friday, 08 March 2024, 08:13:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Epoxy AdhesiveTest Report
27 Feb 2024
Test Report
27 Feb 2024
Test Report
27 Feb 2024
Test Report
27 Feb 2024
Semiconductor DieTest Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Test Report
20 Dec 2022
Solder Ball - Lead FreeTest Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
SubstrateCU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
E700GRTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
GX-13Test Report
28 Apr 2023
Test Report
28 Apr 2023
Test Report
28 Apr 2023
Test Report
28 Apr 2023
SOLDER BALLTest Report
8 Nov 2023
Test Report
8 Nov 2023
Test Report
8 Nov 2023
Test Report
8 Nov 2023
SOLDER MASKTest Report
7 Feb 2023
Test Report
7 Feb 2023
Test Report
7 Feb 2023
Test Report
7 Feb 2023
Thermally Conductive GelTest Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
Test Report
1 Aug 2023
UnderfillTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.