FXLS8964AFR3

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of FXLS8964AFR3Last Revision (GMT):
Thursday, 14 December 2023, 12:41:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
FXLS8964AFR3SOT1615VSON1013.540005 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 770 744712023-11-2471 / Unlimited26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-80.04827696.5429000.356546
Gold and its compoundsGold, metal7440-57-50.0001750.3507000.001295
Palladium and its compoundsPalladium, metal7440-05-30.0015533.1064000.011472
Subtotal0.050005100.00000000.369313
Copper Lead-Frame, Pre-Plated AgCopper AlloyCopper and its compoundsCopper, metal7440-50-85.89137796.78320043.510894
Inorganic Silicon compoundsSilicon7440-21-30.0103730.1704000.076607
Magnesium and its compoundsMagnesium, metal7439-95-40.0018320.0301000.013532
Nickel and its compoundsNickel, metal7440-02-00.1836083.0163001.356040
Subtotal6.087190100.000000044.957074
Silver PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000010
Silver and its compoundsSilver, metal7440-22-40.01280999.9900000.094599
Subtotal0.012810100.00000000.094609
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins0.1500002.5000001.107828
Inorganic Silicon compoundsSilica, vitreous60676-86-04.80000080.00000035.450504
Inorganic Silicon compoundsSilicon dioxide7631-86-90.5700009.5000004.209747
Inorganic compoundsCarbon Black1333-86-40.0300000.5000000.221566
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.4500007.5000003.323485
Subtotal6.000000100.000000044.313130
Epoxy Adhesive 1Epoxy AdhesiveEpoxy ResinsCycloaliphatic Epoxy Resin244772-00-70.0020005.0000000.014771
Inorganic Silicon compoundsSilicon dioxide7631-86-90.02400060.0000000.177253
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.0020005.0000000.014771
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.0020005.0000000.014771
PolymersPlastic: EP - Epoxide, Epoxy0.01000025.0000000.073855
Subtotal0.040000100.00000000.295421
Epoxy Adhesive 2Epoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.03750075.0000000.276957
Organic compoundsOther organic compounds.0.0007501.5000000.005539
PolymersPlastic: EP - Epoxide, Epoxy0.01175023.5000000.086780
Subtotal0.050000100.00000000.369276
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000120.0200000.000089
Tin and its compoundsTin, metal7440-31-50.05998899.9800000.443043
Subtotal0.060000100.00000000.443131
Semiconductor Die 1DieInorganic Silicon compoundsSilicon7440-21-30.88200098.0000006.514030
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0180002.0000000.132939
Subtotal0.900000100.00000006.646969
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon7440-21-30.33320098.0000002.460856
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0068002.0000000.050222
Subtotal0.340000100.00000002.511077
Total13.540005100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 FXLS8964AFR3
Product content declaration of FXLS8964AFR3
上次修订 Last Revision (GMT):
Thursday, 14 December 2023, 12:41:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of FXLS8964AFR3Last Revision (GMT):
Thursday, 14 December 2023, 12:41:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Copper Lead-Frame, Pre-Plated AgAG PLATINGTest Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
C7025Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Die EncapsulantTest Report
15 Mar 2024
Test Report
15 Mar 2024
Test Report
15 Mar 2024
Test Report
15 Mar 2024
Epoxy Adhesive 1Not AvailableNot AvailableNot AvailableNot Available
Epoxy Adhesive 2Test Report
7 Mar 2024
Test Report
7 Mar 2024
Not AvailableNot Available
Post-plating - Lead FreeTest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Semiconductor Die 1Test Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
13 Nov 2023
Test Report
11 Nov 2022
Semiconductor Die 2Test Report
7 May 2021
Test Report
7 May 2021
Test Report
7 May 2021
Test Report
7 May 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.