FXOS8700CQR1

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of FXOS8700CQR1Last Revision (GMT):
Monday, 24 October 2022, 08:49:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
FXOS8700CQR1SOT1680-1TQFN1622.656220 mg YesNoYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 110 115472022-01-0411Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-80.08328896.5429000.367615
Gold and its compoundsGold, metal7440-57-50.0003020.3507000.001335
Palladium and its compoundsPalladium, metal7440-05-30.0026803.1064000.011829
Subtotal0.086270100.00000000.380778
Copper Lead-FrameCopper AlloyCopper and its compoundsCopper, metal7440-50-83.85669995.01600017.022696
Inorganic Silicon compoundsSilicon7440-21-30.0296310.7300000.130784
Iron and its compoundsIron, metal7439-89-60.0051550.1270000.022753
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0012180.0300000.005375
Magnesium and its compoundsMagnesium, metal7439-95-40.0071840.1770000.031711
Manganese and its compoundsManganese, metal7439-96-50.0024350.0600000.010749
Nickel and its compoundsNickel, metal7440-02-00.1311063.2300000.578674
Zinc and its compoundsZinc, metal7440-66-60.0255720.6300000.112868
Subtotal4.059000100.000000017.915610
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000040.0100000.000018
Silver and its compoundsSilver, metal7440-22-40.04099699.9900000.180948
Subtotal0.041000100.00000000.180966
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins0.3525002.5000001.555864
Inorganic Silicon compoundsSilica, vitreous60676-86-011.28000080.00000049.787652
Inorganic Silicon compoundsSilicon dioxide7631-86-91.3395009.5000005.912284
Inorganic compoundsCarbon Black1333-86-40.0705000.5000000.311173
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins1.0575007.5000004.667592
Subtotal14.100000100.000000062.234565
Epoxy AdhesiveEpoxy AdhesiveOrganic Silicon compoundsSilicone modified epoxy resin218163-11-20.09000090.0000000.397242
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.01000010.0000000.044138
Subtotal0.100000100.00000000.441380
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0001000.0200000.000441
Tin and its compoundsTin, metal7440-31-50.49990099.9800002.206458
Subtotal0.500000100.00000002.206900
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon7440-21-30.52266398.0000002.306931
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0106672.0000000.047080
Subtotal0.533330100.00000002.354011
Semiconductor Die 2DieInorganic Silicon compoundsSilicon7440-21-32.65535998.00000011.720223
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0541912.0000000.239188
Subtotal2.709550100.000000011.959411
GlassInorganic Silicon compoundsFibrous-glass-wool65997-17-30.02778232.8510000.122624
Lead and its compoundsLead titanium oxide (PbTiO3)12060-00-30.02900634.2980000.128025
Organic compounds2,2,4-trimethyl-1,3-pentanediol-1-monoisobutyrate25265-77-40.02778232.8510000.122624
Subtotal0.084570100.00000000.373273
Semiconductor Die 3Semiconductor DieInorganic Silicon compoundsSilicon, doped0.43365098.0000001.914044
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0088502.0000000.039062
Subtotal0.442500100.00000001.953106
Total22.656220100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 FXOS8700CQR1
Product content declaration of FXOS8700CQR1
上次修订 Last Revision (GMT):
Monday, 24 October 2022, 08:49:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
铜引线框架
Copper Lead-Frame
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Die
OOOOOO

玻璃
Glass
XOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of FXOS8700CQR1Last Revision (GMT):
Monday, 24 October 2022, 08:49:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
25 Jan 2022
Test Report
25 Jan 2022
Test Report
25 Jan 2022
Test Report
25 Jan 2022
Copper Lead-FrameAG PLATINGTest Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
CDA 194Test Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Die EncapsulantTest Report
6 May 2022
Test Report
6 May 2022
Test Report
6 May 2022
Test Report
6 May 2022
Epoxy AdhesiveTest Report
19 Apr 2021
Test Report
19 Apr 2021
Test Report
19 Apr 2021
Test Report
19 Apr 2021
Post-plating - Lead FreeTest Report
27 Jul 2022
Test Report
27 Jul 2022
Test Report
27 Jul 2022
Test Report
27 Jul 2022
Semiconductor Die 1Test Report
2 Nov 2021
Test Report
2 Nov 2021
Test Report
2 Nov 2021
Test Report
21 Oct 2020
Semiconductor Die 2CAP DIETest Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
LEAD GLASS FRIT DIETest Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Semiconductor Die 3Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
Test Report
18 Jul 2022
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.