FXPS7115DI4T1

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of FXPS7115DI4T1Last Revision (GMT):
Friday, 12 August 2022, 04:19:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
FXPS7115DI4T1SOT1573HQFN16101.438625 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 615 235642022-02-2103 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.02828299.9900000.027881
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000030.0100000.000003
Subtotal0.028285100.00000000.027884
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-80.01589997.2995000.015673
Palladium and its compoundsPalladium, metal7440-05-30.0004412.7005000.000435
Subtotal0.016340100.00000000.016108
Copper Lead-FrameCopper AlloyCopper and its compoundsCopper, metal7440-50-823.74515097.50000023.408391
Iron and its compoundsIron, metal7439-89-60.5650132.3200000.557000
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0073060.0300000.007203
Zinc and its compoundsZinc, metal7440-66-60.0365310.1500000.036013
Subtotal24.354000100.000000024.008606
Silver PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000250.0100000.000024
Silver and its compoundsSilver, metal7440-22-40.24597599.9900000.242487
Subtotal0.246000100.00000000.242511
Die Encapsulant 1Die EncapsulantMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0003000.1000000.000296
PolymersPoly[oxy[trifluoro(trifluoromethyl)-1,2-ethanediyl]],a-(1,1,2,2,2-pentafluoroethyl)-w-[tetrafluoro(trifluoromethyl)ethoxy]60164-51-40.29970099.9000000.295450
Subtotal0.300000100.00000000.295745
Die Encapsulant 2Die EncapsulantPolymersOxetane, 2,2,3,3-tetrafluoro-homopolymer, fluorinated113114-19-50.06525021.7500000.064325
PolymersPoly[oxy[trifluoro(trifluoromethyl)-1,2-ethanediyl]],a-(1,1,2,2,2-pentafluoroethyl)-w-[tetrafluoro(trifluoromethyl)ethoxy]60164-51-40.23467578.2250000.231347
Uncategorized prohibited substancesToluene108-88-30.0000750.0250000.000074
Subtotal0.300000100.00000000.295745
Die Encapsulant 3Die EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins1.2056002.5000001.188502
Inorganic Silicon compoundsSilica, vitreous60676-86-038.57920080.00000038.032061
Inorganic Silicon compoundsSilicon dioxide7631-86-94.5812809.5000004.516307
Inorganic compoundsCarbon Black1333-86-40.2411200.5000000.237700
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins3.6168007.5000003.565506
Subtotal48.224000100.000000047.540077
Epoxy Adhesive 1Epoxy AdhesiveEpoxy ResinsOther Epoxy resins0.01860093.0000000.018336
Organic Silicon compounds(3,4-Epoxycyclohexyl)ethyltrimethoxysilane3388-04-30.0004002.0000000.000394
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.0010005.0000000.000986
Subtotal0.020000100.00000000.019716
Epoxy Adhesive 2Epoxy AdhesiveEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.01400010.0000000.013801
Inorganic Silicon compoundsSilicon dioxide7631-86-90.03500025.0000000.034504
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-60.04200030.0000000.041404
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.03500025.0000000.034504
PolymersAcrylic acid ester copolymer78506-70-40.01400010.0000000.013801
Subtotal0.140000100.00000000.138014
Epoxy Adhesive 3Epoxy AdhesiveEpoxy ResinsOther Epoxy resins0.17800089.0000000.175476
Epoxy ResinsOther Non-halogenated Epoxy resins0.02000010.0000000.019716
Inorganic compoundsCarbon Black1333-86-40.0020001.0000000.001972
Subtotal0.200000100.00000000.197164
LidLidChromium and Chromium III compoundsChromium, metal7440-47-34.56421719.0255004.499487
Inorganic Silicon compoundsSilicon7440-21-30.2402121.0013000.236805
Inorganic compoundsCarbon7440-44-00.0120190.0501000.011848
Inorganic compoundsSulfur7704-34-90.0047980.0200000.004730
Iron and its compoundsIron, metal7439-89-616.57917769.10870016.344048
Manganese and its compoundsManganese, metal7439-96-50.3603301.5020000.355220
Nickel and its compoundsNickel, metal7440-02-02.2220509.2624002.190536
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0071970.0300000.007095
Subtotal23.990000100.000000023.649769
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000200.0200000.000020
Tin and its compoundsTin, metal7440-31-50.09998099.9800000.098562
Subtotal0.100000100.00000000.098582
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon, doped3.25360098.0000003.207457
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0664002.0000000.065458
Subtotal3.320000100.00000003.272915
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon, doped0.19600098.0000000.193220
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0040002.0000000.003943
Subtotal0.200000100.00000000.197164
Total101.438625100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 FXPS7115DI4T1
Product content declaration of FXPS7115DI4T1
上次修订 Last Revision (GMT):
Friday, 12 August 2022, 04:19:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
铜引线框架
Copper Lead-Frame
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant 1
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 2
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 3
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 3
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
盖子
Lid
盖子
Lid
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of FXPS7115DI4T1Last Revision (GMT):
Friday, 12 August 2022, 04:19:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
13 Apr 2022
Test Report
13 Apr 2022
Test Report
13 Apr 2022
Test Report
13 Apr 2022
Bonding Wire - CuPdTest Report
25 Jan 2022
Test Report
25 Jan 2022
Test Report
25 Jan 2022
Test Report
25 Jan 2022
Copper Lead-FrameCDA 194Test Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
NI PLATINGTest Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Test Report
10 Nov 2021
Die Encapsulant 1Test Report
25 Jan 2021
Test Report
25 Jan 2021
Test Report
5 Nov 2020
Test Report
5 Nov 2020
Die Encapsulant 2Test Report
25 Jan 2021
Test Report
25 Jan 2021
Test Report
5 Nov 2020
Test Report
5 Nov 2020
Die Encapsulant 3Test Report
16 Aug 2021
Test Report
16 Aug 2021
Test Report
16 Aug 2021
Test Report
16 Aug 2021
Epoxy Adhesive 1Test Report
6 Oct 2020
Test Report
6 Oct 2020
Test Report
6 Oct 2020
Test Report
6 Oct 2020
Epoxy Adhesive 2Test Report
27 Dec 2021
Test Report
27 Dec 2021
Test Report
27 Dec 2021
Not Available
Epoxy Adhesive 3Test Report
10 Nov 2020
Test Report
10 Nov 2020
Test Report
10 Nov 2020
Test Report
10 Nov 2020
LidTest Report
4 Jan 2021
Test Report
4 Jan 2021
Test Report
3 Jan 2018
Test Report
3 Jan 2018
Post-plating - Lead FreeTest Report
27 Jul 2022
Test Report
27 Jul 2022
Test Report
27 Jul 2022
Test Report
27 Jul 2022
Semiconductor Die 1Test Report
17 Sep 2021
Test Report
17 Sep 2021
Test Report
17 Sep 2021
Test Report
17 Sep 2021
Semiconductor Die 2Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.