FXPS7400A4T1

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of FXPS7400A4T1Last Revision (GMT):
Friday, 08 March 2024, 08:16:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
FXPS7400A4T1SOT1573HQFN16109.400625 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 628 695642023-11-24153 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.02828299.9900000.025852
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000030.0100000.000003
Subtotal0.028285100.00000000.025854
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-80.01589997.2995000.014533
Palladium and its compoundsPalladium, metal7440-05-30.0004412.7005000.000403
Subtotal0.016340100.00000000.014936
Copper Lead-FrameCopper AlloyCopper and its compoundsCopper, metal7440-50-823.74515097.50000021.704766
Iron and its compoundsIron, metal7439-89-60.5650132.3200000.516462
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0073060.0300000.006678
Zinc and its compoundsZinc, metal7440-66-60.0365310.1500000.033392
Subtotal24.354000100.000000022.261299
Silver PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000250.0100000.000023
Silver and its compoundsSilver, metal7440-22-40.24597599.9900000.224839
Subtotal0.246000100.00000000.224862
Die Encapsulant 1Die EncapsulantMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.30000010.0000000.274222
PolymersPropanoyl fluoride, 2,3,3,3-tetrafluoro-2-[1,1,2,3,3,3-hexafluoro-2-(1,1,2,2,3,3,3-heptafluoropropoxy)propoxy]-, polymer with 2,2,3-241148-23-22.70000090.0000002.467993
Subtotal3.000000100.00000002.742215
Die Encapsulant 2Die EncapsulantPlatinum and its compoundsProprietary Material - Other platinum compounds0.30000010.0000000.274222
PolymersPropanoyl fluoride, 2,3,3,3-tetrafluoro-2-[1,1,2,3,3,3-hexafluoro-2-(1,1,2,2,3,3,3-heptafluoropropoxy)propoxy]-, polymer with 2,2,3-241148-23-22.70000090.0000002.467993
Subtotal3.000000100.00000002.742215
Die Encapsulant 3Die EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins3.3756807.0000003.085613
Inorganic Silicon compoundsSilica, vitreous60676-86-038.43452879.70000035.131909
Inorganic Silicon compoundsSilicon dioxide7631-86-94.82240010.0000004.408019
Inorganic compoundsCarbon Black1333-86-40.1446720.3000000.132241
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins1.4467203.0000001.322406
Subtotal48.224000100.000000044.080187
Epoxy Adhesive 1Epoxy AdhesiveEpoxy ResinsOther Epoxy resins0.01860093.0000000.017002
Organic Silicon compounds(3,4-Epoxycyclohexyl)ethyltrimethoxysilane3388-04-30.0004002.0000000.000366
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.0010005.0000000.000914
Subtotal0.020000100.00000000.018281
Epoxy Adhesive 2Epoxy AdhesiveEpoxy ResinsOther Epoxy resins1.72854099.0000001.580009
Inorganic compoundsCarbon Black1333-86-40.0174601.0000000.015960
Subtotal1.746000100.00000001.595969
Epoxy Adhesive 3Epoxy AdhesiveEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.01400010.0000000.012797
Inorganic Silicon compoundsSilicon dioxide7631-86-90.03500025.0000000.031993
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-60.04200030.0000000.038391
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.03500025.0000000.031993
PolymersAcrylic acid ester copolymer78506-70-40.01400010.0000000.012797
Subtotal0.140000100.00000000.127970
LidLidChromium and Chromium III compoundsChromium, metal7440-47-34.56421719.0255004.172021
Inorganic Silicon compoundsSilicon7440-21-30.2402121.0013000.219571
Inorganic compoundsCarbon7440-44-00.0120190.0501000.010986
Inorganic compoundsSulfur7704-34-90.0047980.0200000.004386
Iron and its compoundsIron, metal7439-89-616.57917769.10870015.154554
Manganese and its compoundsManganese, metal7439-96-50.3603301.5020000.329367
Nickel and its compoundsNickel, metal7440-02-02.2220509.2624002.031112
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0071970.0300000.006579
Subtotal23.990000100.000000021.928577
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0001430.0200000.000131
Tin and its compoundsTin, metal7440-31-50.71585799.9800000.654344
Subtotal0.716000100.00000000.654475
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon, doped0.58800098.0000000.537474
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0120002.0000000.010969
Subtotal0.600000100.00000000.548443
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon, doped3.25360098.0000002.974023
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0664002.0000000.060694
Subtotal3.320000100.00000003.034718
Total109.400625100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 FXPS7400A4T1
Product content declaration of FXPS7400A4T1
上次修订 Last Revision (GMT):
Friday, 08 March 2024, 08:16:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
铜引线框架
Copper Lead-Frame
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant 1
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 2
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 3
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 3
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
盖子
Lid
盖子
Lid
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of FXPS7400A4T1Last Revision (GMT):
Friday, 08 March 2024, 08:16:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
Bonding Wire - CuPdTest Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Copper Lead-FrameAG PLATINGTest Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
CDA 194Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Test Report
31 Oct 2023
Die Encapsulant 1Test Report
30 Oct 2023
Test Report
30 Oct 2023
Test Report
30 Oct 2023
Test Report
5 Nov 2020
Die Encapsulant 2Test Report
30 Oct 2023
Test Report
30 Oct 2023
Test Report
30 Oct 2023
Test Report
5 Nov 2020
Die Encapsulant 3Test Report
18 Apr 2023
Test Report
18 Apr 2023
Test Report
18 Apr 2023
Test Report
18 Apr 2023
Epoxy Adhesive 1Test Report
28 Jul 2023
Test Report
28 Jul 2023
Test Report
28 Jul 2023
Test Report
28 Jul 2023
Epoxy Adhesive 2Test Report
12 Dec 2023
Test Report
12 Dec 2023
Test Report
12 Dec 2023
Test Report
12 Dec 2023
Epoxy Adhesive 3Test Report
22 Nov 2023
Test Report
22 Nov 2023
Test Report
22 Nov 2023
Test Report
22 Nov 2023
LidTest Report
3 Jan 2023
Test Report
3 Jan 2023
Test Report
3 Jan 2018
Test Report
3 Jan 2018
Post-plating - Lead FreeTest Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Test Report
19 Jun 2023
Semiconductor Die 1Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Semiconductor Die 2Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.