FXTH87EG11DT1

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NXP Semiconductors
Product content declaration of FXTH87EG11DT1Last Revision (GMT):
Tuesday, 10 May 2022, 11:07:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
FXTH87EG11DT1SOT1575HQFN24298.649978 mg YesNoYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 515 325282022-03-1810Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - Au 1Bonding Wire - AuGold and its compoundsGold, metal7440-57-50.09997499.9900000.033475
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000100.0100000.000003
Subtotal0.099984100.00000000.033479
Bonding Wire - Au 2Bonding Wire - AuGold and its compoundsGold, metal7440-57-50.39995499.9900000.133921
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000400.0100000.000013
Subtotal0.399994100.00000000.133934
Copper Lead-Frame, Pre-PlatedCopper Lead-Frame, Pre-PlatedCopper and its compoundsCopper, metal7440-50-86.98229496.9763002.337952
Gold and its compoundsGold, metal7440-57-50.0013680.0190000.000458
Iron and its compoundsIron, metal7439-89-60.1538142.1363000.051503
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000720.0010000.000024
Nickel and its compoundsNickel, metal7440-02-00.0573120.7960000.019190
Palladium and its compoundsPalladium, metal7440-05-30.0018000.0250000.000603
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0020450.0284000.000685
Silver and its compoundsSilver, metal7440-22-40.0012960.0180000.000434
Subtotal7.200000100.00000002.410849
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins14.9504897.5015005.006024
Inorganic Silicon compoundsSilica, vitreous60676-86-0163.41882581.99640054.719182
Inorganic Silicon compoundsSilicon dioxide7631-86-914.9504897.5015005.006024
Inorganic compoundsCarbon Black1333-86-40.9966990.5001000.333735
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins4.9834972.5005001.668675
Subtotal199.300000100.000000066.733640
Epoxy Adhesive 1Epoxy AdhesiveEpoxy ResinsOther Epoxy resins0.37200093.0000000.124561
Organic Silicon compounds(3,4-Epoxycyclohexyl)ethyltrimethoxysilane3388-04-30.0080002.0000000.002679
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.0200005.0000000.006697
Subtotal0.400000100.00000000.133936
Epoxy Adhesive 2Epoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.04500045.0000000.015068
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0000100.0100000.000003
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0050005.0000000.001674
PolymersPlastic: EP - Epoxide, Epoxy0.04999049.9900000.016739
Subtotal0.100000100.00000000.033484
Epoxy Adhesive 3Epoxy AdhesiveEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.01000010.0000000.003348
Inorganic Silicon compoundsSilicon dioxide7631-86-90.02500025.0000000.008371
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-60.03000030.0000000.010045
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.02500025.0000000.008371
PolymersAcrylic acid ester copolymer78506-70-40.01000010.0000000.003348
Subtotal0.100000100.00000000.033484
Epoxy Adhesive 4Epoxy AdhesiveEpoxy ResinsOther Epoxy resins0.39600099.0000000.132597
Inorganic compoundsCarbon Black1333-86-40.0040001.0000000.001339
Subtotal0.400000100.00000000.133936
LidLidChromium and Chromium III compoundsChromium, metal7440-47-312.62411818.1381004.227061
Inorganic Silicon compoundsSilicon7440-21-30.4377140.6289000.146564
Inorganic compoundsCarbon7440-44-00.0347300.0499000.011629
Inorganic compoundsSulfur7704-34-90.0020880.0030000.000699
Iron and its compoundsIron, metal7439-89-649.57434071.22750016.599479
Manganese and its compoundsManganese, metal7439-96-50.7295471.0482000.244282
Nickel and its compoundsNickel, metal7440-02-05.9890108.6049002.005361
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.2084520.2995000.069798
Subtotal69.600000100.000000023.304874
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon, doped5.24300098.0000001.755567
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1070002.0000000.035828
Subtotal5.350000100.00000001.791395
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon, doped6.27200098.0000002.100117
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1280002.0000000.042860
Subtotal6.400000100.00000002.142977
Semiconductor Die 3DieInorganic Silicon compoundsSilicon7440-21-32.47088098.0000000.827350
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0504262.0000000.016885
Subtotal2.521306100.00000000.844234
GlassInorganic Silicon compoundsFibrous-glass-wool65997-17-30.02585232.8510000.008656
Lead and its compoundsLead titanium oxide (PbTiO3)12060-00-30.02699134.2980000.009038
Organic compounds2,2,4-trimethyl-1,3-pentanediol-1-monoisobutyrate25265-77-40.02585232.8510000.008656
Subtotal0.078694100.00000000.026350
Thermally Conductive Gel 1Thermally Conductive GelOrganic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.2010006.0000000.067303
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-60.90450027.0000000.302863
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-22.24450067.0000000.751549
Subtotal3.350000100.00000001.121714
Thermally Conductive Gel 2Thermally Conductive GelOrganic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-61.21818136.3636000.407896
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-22.03030460.6061000.679827
Organic Silicon compoundsTetra (trimethylsiloxy) silane3555-47-30.1015153.0303000.033991
Subtotal3.350000100.00000001.121714
Total298.649978100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 FXTH87EG11DT1
Product content declaration of FXTH87EG11DT1
上次修订 Last Revision (GMT):
Tuesday, 10 May 2022, 11:07:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au 1
焊丝-金
Bonding Wire - Au
OOOOOO
焊丝-金
Bonding Wire - Au 2
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 3
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 4
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
盖子
Lid
盖子
Lid
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Die
OOOOOO

玻璃
Glass
XOOOOO
导热凝胶
Thermally Conductive Gel 1
导热凝胶
Thermally Conductive Gel
OOOOOO
导热凝胶
Thermally Conductive Gel 2
导热凝胶
Thermally Conductive Gel
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of FXTH87EG11DT1Last Revision (GMT):
Tuesday, 10 May 2022, 11:07:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - Au 1Test Report
19 Apr 2021
Test Report
19 Apr 2021
Test Report
19 Apr 2021
Test Report
19 Apr 2021
Bonding Wire - Au 2Test Report
19 Apr 2021
Test Report
19 Apr 2021
Test Report
19 Apr 2021
Test Report
19 Apr 2021
Copper Lead-Frame, Pre-PlatedTest Report
14 Jan 2019
Test Report
14 Jan 2019
Test Report
14 Jan 2019
Test Report
14 Jan 2019
Die EncapsulantTest Report
21 Jan 2022
Test Report
21 Jan 2022
Test Report
21 Jan 2022
Test Report
21 Jan 2022
Epoxy Adhesive 1Test Report
6 Oct 2020
Test Report
6 Oct 2020
Test Report
6 Oct 2020
Test Report
6 Oct 2020
Epoxy Adhesive 2Test Report
5 Jul 2021
Test Report
5 Jul 2021
Test Report
5 Jul 2021
Test Report
5 Jul 2021
Epoxy Adhesive 3Test Report
27 Dec 2021
Test Report
27 Dec 2021
Test Report
27 Dec 2021
Not Available
Epoxy Adhesive 4Test Report
5 Oct 2021
Test Report
5 Oct 2021
Test Report
5 Oct 2021
Test Report
5 Oct 2021
LidTest Report
30 Apr 2021
Test Report
30 Apr 2021
Test Report
30 Apr 2021
Test Report
30 Apr 2021
Semiconductor Die 1Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Semiconductor Die 2Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Semiconductor Die 3CAP DIETest Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
LEAD GLASS FRIT DIETest Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Thermally Conductive Gel 1Test Report
3 May 2021
Test Report
3 May 2021
Test Report
3 May 2021
Test Report
3 May 2021
Thermally Conductive Gel 2Test Report
3 May 2021
Test Report
3 May 2021
Test Report
3 May 2021
Test Report
3 May 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.