FXTH87EH12DT1

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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NXP Semiconductors
Product content declaration of FXTH87EH12DT1Last Revision (GMT):
Tuesday, 10 May 2022, 11:15:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
FXTH87EH12DT1SOT1575HQFN24298.064452 mg YesNoYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 515 345282022-03-188Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - Au 1Bonding Wire - AuGold and its compoundsGold, metal7440-57-50.50377099.9900000.169014
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000500.0100000.000017
Subtotal0.503820100.00000000.169031
Bonding Wire - Au 2Bonding Wire - AuGold and its compoundsGold, metal7440-57-50.06062699.9900000.020340
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000060.0100000.000002
Subtotal0.060632100.00000000.020342
Copper Lead-Frame, Pre-PlatedCopper Lead-Frame, Pre-PlatedCopper and its compoundsCopper, metal7440-50-86.98229496.9763002.342545
Gold and its compoundsGold, metal7440-57-50.0013680.0190000.000459
Iron and its compoundsIron, metal7439-89-60.1538142.1363000.051604
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000720.0010000.000024
Nickel and its compoundsNickel, metal7440-02-00.0573120.7960000.019228
Palladium and its compoundsPalladium, metal7440-05-30.0018000.0250000.000604
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0020450.0284000.000686
Silver and its compoundsSilver, metal7440-22-40.0012960.0180000.000435
Subtotal7.200000100.00000002.415585
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins14.9504897.5015005.015858
Inorganic Silicon compoundsSilica, vitreous60676-86-0163.41882581.99640054.826674
Inorganic Silicon compoundsSilicon dioxide7631-86-914.9504897.5015005.015858
Inorganic compoundsCarbon Black1333-86-40.9966990.5001000.334390
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins4.9834972.5005001.671953
Subtotal199.300000100.000000066.864733
Epoxy Adhesive 1Epoxy AdhesiveEpoxy ResinsOther Epoxy resins0.37200093.0000000.124805
Organic Silicon compounds(3,4-Epoxycyclohexyl)ethyltrimethoxysilane3388-04-30.0080002.0000000.002684
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.0200005.0000000.006710
Subtotal0.400000100.00000000.134199
Epoxy Adhesive 2Epoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.04500045.0000000.015097
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0000100.0100000.000003
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0050005.0000000.001677
PolymersPlastic: EP - Epoxide, Epoxy0.04999049.9900000.016772
Subtotal0.100000100.00000000.033550
Epoxy Adhesive 3Epoxy AdhesiveEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.01000010.0000000.003355
Inorganic Silicon compoundsSilicon dioxide7631-86-90.02500025.0000000.008387
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-60.03000030.0000000.010065
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.02500025.0000000.008387
PolymersAcrylic acid ester copolymer78506-70-40.01000010.0000000.003355
Subtotal0.100000100.00000000.033550
Epoxy Adhesive 4Epoxy AdhesiveEpoxy ResinsOther Epoxy resins2.22500089.0000000.746483
Epoxy ResinsOther Non-halogenated Epoxy resins0.25000010.0000000.083875
Inorganic compoundsCarbon Black1333-86-40.0250001.0000000.008387
Subtotal2.500000100.00000000.838745
LidLidChromium and Chromium III compoundsChromium, metal7440-47-313.24174819.0255004.442579
Inorganic Silicon compoundsSilicon7440-21-30.6969051.0013000.233810
Inorganic compoundsCarbon7440-44-00.0348700.0501000.011699
Inorganic compoundsSulfur7704-34-90.0139200.0200000.004670
Iron and its compoundsIron, metal7439-89-648.09965569.10870016.137334
Manganese and its compoundsManganese, metal7439-96-51.0453921.5020000.350727
Nickel and its compoundsNickel, metal7440-02-06.4466309.2624002.162831
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0208800.0300000.007005
Subtotal69.600000100.000000023.350654
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon, doped6.27200098.0000002.104243
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1280002.0000000.042944
Subtotal6.400000100.00000002.147187
Semiconductor Die 2DieInorganic Silicon compoundsSilicon7440-21-32.47088098.0000000.828975
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0504262.0000000.016918
Subtotal2.521306100.00000000.845893
GlassInorganic Silicon compoundsFibrous-glass-wool65997-17-30.02585232.8510000.008673
Lead and its compoundsLead titanium oxide (PbTiO3)12060-00-30.02699134.2980000.009055
Organic compounds2,2,4-trimethyl-1,3-pentanediol-1-monoisobutyrate25265-77-40.02585232.8510000.008673
Subtotal0.078694100.00000000.026402
Semiconductor Die 3Semiconductor DieInorganic Silicon compoundsSilicon, doped2.54800098.0000000.854849
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0520002.0000000.017446
Subtotal2.600000100.00000000.872295
Thermally Conductive Gel 1Thermally Conductive GelOrganic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-61.21818136.3636000.408697
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-22.03030460.6061000.681163
Organic Silicon compoundsTetra (trimethylsiloxy) silane3555-47-30.1015153.0303000.034058
Subtotal3.350000100.00000001.123918
Thermally Conductive Gel 2Thermally Conductive GelOrganic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-61.21818136.3636000.408697
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-22.03030460.6061000.681163
Organic Silicon compoundsTetra (trimethylsiloxy) silane3555-47-30.1015153.0303000.034058
Subtotal3.350000100.00000001.123918
Total298.064452100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 FXTH87EH12DT1
Product content declaration of FXTH87EH12DT1
上次修订 Last Revision (GMT):
Tuesday, 10 May 2022, 11:15:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au 1
焊丝-金
Bonding Wire - Au
OOOOOO
焊丝-金
Bonding Wire - Au 2
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 3
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 4
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
盖子
Lid
盖子
Lid
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Die
OOOOOO

玻璃
Glass
XOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
OOOOOO
导热凝胶
Thermally Conductive Gel 1
导热凝胶
Thermally Conductive Gel
OOOOOO
导热凝胶
Thermally Conductive Gel 2
导热凝胶
Thermally Conductive Gel
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of FXTH87EH12DT1Last Revision (GMT):
Tuesday, 10 May 2022, 11:15:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - Au 1Test Report
19 Apr 2021
Test Report
19 Apr 2021
Test Report
19 Apr 2021
Test Report
19 Apr 2021
Bonding Wire - Au 2Test Report
19 Apr 2021
Test Report
19 Apr 2021
Test Report
19 Apr 2021
Test Report
19 Apr 2021
Copper Lead-Frame, Pre-PlatedTest Report
14 Jan 2019
Test Report
14 Jan 2019
Test Report
14 Jan 2019
Test Report
14 Jan 2019
Die EncapsulantTest Report
21 Jan 2022
Test Report
21 Jan 2022
Test Report
21 Jan 2022
Test Report
21 Jan 2022
Epoxy Adhesive 1Test Report
6 Oct 2020
Test Report
6 Oct 2020
Test Report
6 Oct 2020
Test Report
6 Oct 2020
Epoxy Adhesive 2Test Report
5 Jul 2021
Test Report
5 Jul 2021
Test Report
5 Jul 2021
Test Report
5 Jul 2021
Epoxy Adhesive 3Test Report
27 Dec 2021
Test Report
27 Dec 2021
Test Report
27 Dec 2021
Not Available
Epoxy Adhesive 4Test Report
10 Nov 2020
Test Report
10 Nov 2020
Test Report
10 Nov 2020
Test Report
10 Nov 2020
LidTest Report
3 Jan 2018
Test Report
3 Jan 2018
Test Report
3 Jan 2018
Test Report
3 Jan 2018
Semiconductor Die 1Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Semiconductor Die 2CAP DIETest Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
LEAD FRIT GLASSNot AvailableNot AvailableTest Report
19 Aug 2021
Not Available
LEAD GLASS FRIT DIETest Report
19 Aug 2021
Test Report
19 Aug 2021
Not AvailableTest Report
19 Aug 2021
Semiconductor Die 3Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Test Report
19 Aug 2021
Thermally Conductive Gel 1Test Report
28 Apr 2020
Test Report
28 Apr 2020
Test Report
28 Apr 2020
Test Report
28 Apr 2020
Thermally Conductive Gel 2Test Report
28 Apr 2020
Test Report
28 Apr 2020
Test Report
28 Apr 2020
Test Report
28 Apr 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.